Induction heating for underfill removal and chip rework
Underfill materials and methods for removing an underfill material from beneath a chip in relation to removal of the chip from a substrate. The underfill material may a plurality of particles dispersed in a bulk matrix. The material constituting the particles may be capable of generating heat energy when exposed to a time-varying magnetic field. The bulk matrix of the underfill material between the chip and a substrate may be heated with heat energy transferred from the particles. While heated, the underfill material is removed. The heating of the underfill material may also be used to heat solder bumps connecting the chip with the substrate so that the solder bumps are liquefied.
1. A method for removing an underfill material from beneath a chip, the method comprising:
heating the underfill material with induction heating; and
while the underfill material is heated, removing the underfill material from beneath the chip.
2. The method of claim 1 wherein heating the underfill material comprises:
coupling a time-varying magnetic field with a plurality of particles in the underfill material to heat the particles; and
transferring heat energy from the particles to a bulk matrix of the underfill material.
3. The method of claim 2 wherein the particles are comprised of a ferromagnetic material, and the time-varying magnetic field induces eddy currents in the ferromagnetic material of the particles to produce the heat energy.
4. The method of claim 2 wherein the particles are comprised of a ferriceramic material, and the time-varying magnetic field induces magnetic hysteresis losses in the ferriceramic material of the particles to produce the heat energy.
5. The method of claim 2 wherein coupling the time-varying magnetic field with the particles in the underfill material comprises:
passing an electrical current through an induction coil to generate the time-varying magnetic field.
6. The method of claim 1 wherein the underfill material includes a bulk matrix that is transformed from a solid phase to a liquid phase or a semisolid state by the induction heating, and the underfill material is removed while the underfill material is in the liquid phase or in the semisolid state.
7. The method of claim 6 wherein a plurality of first pads on the chip are coupled by a plurality of solder bumps with a plurality of second pads on a substrate, and the bulk matrix of the underfill material transforms from the solid phase to the liquid phase or the semisolid state at a first temperature less than a second temperature at which the solder bumps liquefy.
8. A method for reworking a chip, the method comprising:
heating an underfill material between the chip and a substrate with induction heating;
heating a plurality of solder bumps coupling a plurality of first pads on the chip with a plurality of second pads on the substrate; and
while the underfill material and the solder bumps are heated, removing the chip from the substrate.
9. The method of claim 8 wherein heating the underfill material comprises:
coupling a time-varying magnetic field with a plurality of particles in the underfill material to heat the particles; and
transferring heat energy from the particles to a bulk matrix of the underfill material.
10. The method of claim 9 wherein heating the solder bumps further comprises:
transferring the heat energy from the bulk matrix of the underfill material to the solder bumps.
11. The method of claim 9 wherein the particles are comprised of a ferromagnetic material, and the time-varying magnetic field induces eddy currents in the ferromagnetic material of the particles to produce the heat energy.
12. The method of claim 9 wherein the particles are comprised of a ferriceramic material, and the time-varying magnetic field induces magnetic hysteresis losses in the ferriceramic material of the particles to produce the heat energy.
13. The method of claim 9 wherein coupling the time-varying magnetic field with the particles in the underfill material comprises:
passing an electrical current through an induction coil to generate the time-varying magnetic field.
14. The method of claim 8 wherein the underfill material includes a bulk matrix that is transformed by the induction heating from a solid phase to a liquid phase or a semisolid state at a first temperature, the solder bumps are liquefied by the heating at a second temperature, and the chip is removed from the substrate while the underfill material is in the liquid phase or in the semisolid state and the solder bumps are liquefied.
15. The method of claim 14 wherein the first temperature less than the second temperature.
16. The method of claim 14 wherein the first temperature is greater than the second temperature.