FinFET conformal junction and abrupt junction with reduced damage method and device
A method of forming a source/drain region with abrupt vertical and conformal junction and the resulting device are disclosed. Embodiments include forming a first mask over a fin of a first polarity FET and source/drain regions of the first polarity FET; forming spacers on opposite sides of a fin of a second polarity FET, the second polarity being opposite the first polarity, on each side of a gate electrode; implanting a first dopant into the fin of the second polarity FET; etching a cavity in the fin of the second polarity FET on each side of the gate electrode; removing the first mask; performing rapid thermal anneal (RTA); epitaxially growing a source/drain region of the second polarity FET in each cavity; forming a second mask over the fin of the first polarity FET and source/drain regions of the first polarity FET; and implanting a second dopant in the source/drain regions of the second polarity FET.
1. A device comprising:
a PFET fin and an NFET fin on a substrate;
a gate electrode over and perpendicular to the PFET fin and the NFET fin;
PFET source/drain regions on the PFET fin at opposite sides of the gate electrode; and
epitaxially grown, arsenic doped NFET source/drain regions in cavities in the NFET fin at opposite sides of the gate electrode,
wherein each NFET source/drain region has a conformal junction with an abrupt, vertical, and conformal junction boundary.
2. The device according to claim 1 , wherein the epitaxially grown source/drain regions comprise silicon phosphide (SiP).
3. The device according to claim 1 , wherein the NFET fin is implanted with arsenic at a dose of 1e14 cm −3 to 1e16 cm −3 .
4. The device according to claim 3 , wherein the arsenic is doped at an energy of 1 kiloelectron Volt (keV) to 10 keV, and a zero degree tilt prior to formation of the cavities.
5. The device according to claim 1 , wherein the epitaxially grown source/drain region is doped with arsenic at a dose of 1e14 cm −3 to 1e16 cm −3 .
6. The device according to claim 5 , wherein the arsenic is doped at an energy of 0.5 keV to 5 keV, and a maximum tilt after the epitaxial growth.
7. A device comprising:
a fin of a first polarity FET and a fin of a second polarity FET formed on a substrate;
a gate electrode formed over and perpendicular to the fin of the first polarity FET and the fin of the second polarity FET;
first source/drain regions formed on the fin of the first polarity FET at opposite sides of the gate electrode; and
epitaxially grown, second source/drain regions formed in cavities in the fin of the second polarity FET at opposite sides of the gate electrode,
wherein the second source/drain regions of the fin of the second polarity FET have a conformal junction with an abrupt, vertical, and conformal junction boundary.
8. The device according to claim 7 , wherein the second polarity is opposite the first polarity.
9. The device according to claim 7 , wherein the epitaxially grown second source/drain regions comprise silicon phosphide (SiP).
10. The device according to claim 7 , wherein the fin of the second polarity FET is implanted with arsenic at a dose of 1e14 cm −3 to 1e16 cm −3 .
11. The device according to claim 10 , wherein the arsenic is doped at an energy of 1 kiloelectron Volt (keV) to 10 keV, and a zero degree tilt prior to formation of the cavities.
12. The device according to claim 7 , wherein the fin of the second polarity FET is a NFET fin.
13. The device according to claim 7 , wherein the fin of the first polarity FET is a PFET fin.
14. The device according to claim 7 , wherein the epitaxially grown second source/drain regions are doped with arsenic at a dose of 1e14 cm −3 to 1e16 cm −3 .
15. The device according to claim 14 , wherein the arsenic is doped at an energy of 0.5 keV to 5 keV, and a maximum tilt after the epitaxial growth.
16. A device comprising:
a PFET fin and an NFET fin formed on a substrate;
shallow trench isolation (STI) regions formed between the PFET fin and the NFET fin;
a gate electrode formed over and perpendicular to the PFET fin and the NFET fin;
PFET source/drain regions formed on the PFET fin at opposite sides of the gate electrode;
spacers formed on sidewalls of the NFET fin on each side of the gate electrode;
a cavity formed in the NFET fin on each side of the gate electrode; and
epitaxially grown, source/drain region formed in each cavity, wherein:
arsenic is implanted into the NFET fin at a dose of 1e14 cm −3 to 1e16 cm −3 and with zero tilt with respect to the sidewall,
arsenic is implanted in the NFET source/drain regions at a dose of 1e14 cm −3 to 1e16 cm −3 and with zero degrees of rotation and a maximum tilt, and
boron or boron fluoride (BF 2 ) is implanted into the PFET source/drain regions.
17. The device according to claim 16 , wherein the arsenic is implanted into the NFET fin at an energy of 3 kiloelectron Volts (keV) to 10 keV.
18. The device according to claim 16 , wherein the arsenic is implanted into the NFET source/drain regions at an energy of 0.5 keV to 5 keV.
19. The device according to claim 16 , wherein the epitaxially grown source/drain regions comprise silicon phosphide (SiP).
20. The device according to claim 16 , wherein each epitaxially grown source/drain region has a conformal junction with an abrupt, vertical, and conformal junction boundary.