FinFET with merge-free fins
A semiconductor device comprises an insulation layer, an active semiconductor layer formed on an upper surface of the insulation layer, and a plurality of fins formed on the insulation layer. The fins are formed in the gate and spacer regions between a first source/drain region and second source/drain region, without extending into the first and second source/drain regions.
1. A method of fabricating semiconductor device, the method comprising:
forming an insulation layer having a length extending along a first direction and a width extending along a second direction perpendicular to the first direction, the insulation layer having a gate insulation region disposed between first and second non-gate insulation regions; forming an active semiconductor layer on an upper surface of the insulation layer;
forming a masking layer on an upper surface of the active semiconductor layer: forming a gate pocket above the insulation layer and through the masking layer and the active semiconductor layer to expose the insulation layer;
forming a plurality of fins at the gate insulation region and between the first and second non-gate insulation regions within the gate pocket;
forming a spacer material which covers the plurality of fins in the gate pocket and the insulation layer; and
etching the spacer material which covers the plurality of fins in the gate pocket and the insulation layer to expose the plurality of fins, while maintaining the spacer material on sidewalk of the gate pocket; and
forming a dummy gate in the gate pocket after etching the spacer material.
2. The method of claim 1 , extending each fin along the first direction to define a fin length that does not exceed a length of the gate insulation region.
3. The method of claim 2 , further comprising arranging the plurality of fins along the second direction of the insulation layer.
4. The method of claim 1 , further comprising forming a gate stack in the gate pocket to cover the plurality of fins.
5. The method of claim 4 , further comprising forming a gate insulation layer comprising a high-k material at the gate stack.
6. The method of claim 5 , further comprising coupling an electrode to the gate insulation layer.
7. A method of fabricating semiconductor device, the method comprising:
forming an insulation layer having a length extending along a first direction and a width extending along a second direction perpendicular to the first direction, the insulation layer having a gate insulation region disposed between first and second non-gate insulation regions;
forming an active semiconductor layer on an upper surface of the insulation layer;
forming a gate pocket above the insulation layer;
forming a plurality of fins at the gate insulation region and between the first and second non-gate insulation regions within the gate pocket;
forming a spacer material which covers the plurality of fins in the gate pocket and the insulation layer;
etching the spacer material which covers the plurality of fins in the gate pocket and the insulation layer to expose the plurality of fins, while maintaining the spacer material on sidewalls of the gate pocket;
forming another spacer material on a side of the spacer material such that the another spacer material is adjacent to the first and second non-gate insulation regions;
forming a gate stack in the gate pocket between the spacer material by depositing a gate material in the gate pocket to cover the plurality of fins; and
extending the spacer material by an ion implanting process.
8. The method of claim 7 , wherein the another spacer material is between the spacer material and a masking layer and is over the active semiconductor layer.
9. The method of claim 8 , further comprising forming a gate insulation layer and a metal electrode between the spacer material and over the plurality of fins such that the metal electrode is between the gate material of the gate stack and the gate insulation layer and the gate insulation layer is between the metal electrode and the spacer material.
10. The method of claim 9 , further comprising:
forming source and drain regions in the first and second non-gate insulation regions by the ion implanting process; and
forming the masking layer on an upper surface of the active semiconductor layer after the ion implanting process to form the source and drain regions in the first and second non-gate insulation regions.