Clip based speaker retention to a mounting surface
The technology disclosed herein enables retention of a speaker on a mounting surface using a clip and a flange. In a particular embodiment, an apparatus includes a speaker comprising a substantially elliptic speaker frame. The apparatus further includes a mounting surface comprising a substantially cylindrical flange into which the speaker frame is positioned. Also, the apparatus includes a substantially elliptic clip positioned in the flange between the speaker frame and a retaining rim of the flange.
1. An apparatus for audio component retention, comprising:
an audio component comprising a frame;
a mounting surface comprising a flange, wherein the frame is positioned into a first portion of the flange, wherein the flange is substantially cylindrical; and
a clip positioned in the first portion of the flange between the frame and a retaining rim of the flange, wherein the retaining rim comprises a second portion of the flange with a smaller inner diameter than the first portion of the flange, and wherein the shape of the clip was manipulated to fit the clip through the retaining rim and into the first portion of the flange.
2. The apparatus of claim 1 , wherein the clip includes a gap in a perimeter of the clip.
3. The apparatus of claim 2 , wherein, on each side of the gap, the clip includes a tool grip point corresponding to a tool for positioning the clip.
4. The apparatus of claim 1 , further comprising:
at least one vibration dampening element positioned in the first portion of the flange to isolate the audio component from the mounting surface and the clip.
5. The apparatus of claim 4 , wherein the at least one vibration dampening element is of similar shape to the frame.
6. The apparatus of claim 1 , wherein the audio component faces the mounting surface.
7. The apparatus of claim 6 , wherein the mounting surface includes at least one opening through which sound passes.
8. The apparatus of claim 1 , wherein the audio component faces away from the mounting surface and an opening in the mounting surface allows portions of the audio component, other than the frame, to pass through the mounting surface.
9. The apparatus of claim 1 , wherein the mounting surface is included in a device that uses the audio component.
10. The apparatus of claim 1 , wherein the audio component comprises a microphone.
11. A method for retaining an audio component to a mounting surface, comprising:
positioning a frame of the audio component into a first portion of a flange of the mounting surface, wherein the flange is substantially cylindrical; and
positioning a clip into the first portion of the flange between the frame and a retaining rim of the flange, wherein the retaining rim comprises a second portion of the flange with a smaller inner diameter than the first portion of the flange, and wherein the shape of the clip is manipulated to fit the clip through the retaining rim and into the first portion of the flange.
12. The method of claim 11 , wherein the clip includes a gap in a perimeter of the clip.
13. The method of claim 12 , wherein positioning the clip comprises:
squeezing the clip to reduce a size of the gap such that the clip fits through the rim and into the first portion of the flange; and
releasing the clip once the clip is in the first portion of the flange.
14. The method of claim 13 , wherein positioning the clip comprises:
gripping the clip on each side of the gap using a positioning tool gripping onto grip points on each side of the gap.
15. The method of claim 11 , further comprising:
positioning at least one vibration dampening element in the first portion of the flange to isolate the audio component from the mounting surface and the clip.
16. The method of claim 15 , wherein the at least one vibration dampening element is of similar shape to the frame.
17. The method of claim 11 , wherein the audio component faces the mounting surface.
18. The method of claim 17 , wherein the mounting surface includes at least one opening through which sound passes.
19. The method of claim 11 , wherein the audio component faces away from the mounting surface and an opening in the mounting surface allows portions of the audio component, other than the frame, to pass through the mounting surface.
20. The method of claim 11 , wherein the mounting surface is included in a device that uses the audio component.