STEP-DOWN PRINTED CIRCUIT BOARD WITH A FLEXIBLE CONNECTOR
A semiconductor package includes a step-down PCB. The step-down PCB includes a first portion having a first height a second portion having a second height that is less than the first height. The step-down PCB can be a single, unitary structure or have different PCB portions. When the step-down PCB has different PCB portions, a flexible connector mechanically and electrically couples the PCB portions together. Due to the reduced thickness of the second portion, additional semiconductor dies can be added to a stack of semiconductor dies, thereby increasing the capabilities of the semiconductor package. Additionally, the first portion includes contacts for a connector. The connector is used to communicatively couple the semiconductor package to an associated connector slot of a host device.
1 . A semiconductor package, comprising:
a first printed circuit board (PCB) portion having a first thickness;
a second PCB portion having a second thickness that is less than the first thickness;
a flexible connector provided between the first PCB portion and the second PCB portion, the flexible connector mechanically and electrically connecting the first PCB portion and the second PCB portion;
a plurality of contacts provided on the first PCB portion for electrically coupling the semiconductor package to a connector of a host device; and
a plurality of semiconductor dies provided on the second PCB portion.
2 . The semiconductor package of claim 1 , further comprising one or more passive components mounted on the second PCB portion.
3 . The semiconductor package of claim 1 , wherein at least one of the plurality of semiconductor dies is a NAND memory die.
4 . The semiconductor package of claim 1 , wherein at least one of the plurality of semiconductor dies is an application-specific integrated circuit (ASIC).
5 . The semiconductor package of claim 1 , further comprising a molding compound at least partially covering the second PCB portion.
6 . The semiconductor package of claim 1 , wherein the plurality of contacts are part of an M.2 connector.
7 . The semiconductor package of claim 1 , wherein the plurality of contacts are part of an Enterprise and Datacenter Standard Form Factor (EDSFF) connector.
8 . The semiconductor package of claim 1 , wherein the flexible connector extends from a top portion of the first PCB portion.
9 . The semiconductor package of claim 1 , wherein the flexible connector extends from a middle portion of the first PCB portion.
10 . The semiconductor package of claim 1 , wherein the flexible connector extends from a top portion of the second PCB portion.
11 . The semiconductor package of claim 1 , wherein the flexible connector extends from a middle portion of the second PCB portion.
12 . A semiconductor package, comprising:
a plurality of contacts provided on a first printed circuit board (PCB) portion, the first PCB portion having a first number of layers and a first thickness;
a plurality of semiconductor dies provided on a second PCB portion, the second PCB portion being separate from the first PCB portion and having a second number of layers that is less that the first number of layers and having a second thickness that is less than the first thickness; and
a flexible connector coupling the first PCB portion and the second PCB portion.
13 . The semiconductor package of claim 12 , further comprising a cover at least partially encapsulating the second PCB portion.
14 . The semiconductor package of claim 12 , wherein the plurality of contacts form an M.2 connector.
15 . The semiconductor package of claim 12 , wherein the plurality of contacts form an Enterprise and Datacenter Standard Form Factor (EDSFF) connector.
16 . The semiconductor package of claim 12 , wherein the flexible connector extends from a top portion of the first PCB portion.
17 . The semiconductor package of claim 12 , wherein the flexible connector extends from a middle portion of the second PCB portion.
18 . A semiconductor package, comprising:
a first printed circuit board (PCB) portion having a first thickness;
a second PCB portion having a second thickness that is less than the first thickness;
a flexible connection means provided between the first PCB portion and the second PCB portion, the flexible connection means mechanically and electrically coupling the first PCB portion and the second PCB portion;
a plurality of signal carrying means provided on a surface of the first PCB portion; and
a plurality of semiconductor dies provided on the second PCB portion.
19 . The semiconductor package of claim 18 , further comprising a covering means provided on the second PCB portion.
20 . The semiconductor package of claim 18 , wherein the semiconductor dies are NAND memory dies.