SEMICONDUCTOR PACKAGE HAVING INTERCONNECTABLE SUBSTRATES
A semiconductor package includes a number of different substrate sections. Each substrate section includes one or more electronic components. Additionally, each substrate section is mechanically and electrically coupled together using various conductive columns and conductive apertures. Because the substrate sections are interconnectable, a shape and/or a size of the semiconductor package is fully customizable. Additionally, a layout of the various electronic components of the semiconductor package is also fully customizable.
1 . A semiconductor package, comprising:
a substrate, comprising:
a first planar surface;
a second planar surface opposite the first planar surface;
a first ledge extending from a first lateral side of the substrate, the first ledge and the first planar surface forming a first stairstep configuration;
a plurality of conductive columns provided on the first ledge;
a second ledge extending from a second lateral side of the substrate, the second ledge and the second planar surface forming a second stairstep configuration; and
a plurality of conductive apertures defined by the second ledge; and
at least one electronic component electrically coupled to at least one of the first planar surface and the second planar surface.
2 . The semiconductor package of claim 1 , further comprising at least one trace extending from at least one conductive column of the plurality of conductive columns.
3 . The semiconductor package of claim 1 , further comprising at least one trace extending from at least one conductive aperture of the plurality of conductive apertures.
4 . The semiconductor package of claim 3 , wherein the at least one conductive aperture includes a conductive layer.
5 . The semiconductor package of claim 1 , wherein the substrate is a first substrate and wherein the semiconductor package further comprises:
a second substrate, comprising:
a third planar surface;
a fourth planar surface opposite the third planar surface;
a third ledge extending from a first lateral side of the second substrate, the third ledge and the third planar surface forming a third stairstep configuration;
a plurality of conductive columns provided on the third ledge;
a fourth ledge extending from a second lateral side of the second substrate, the fourth ledge and the fourth planar surface forming a fourth stairstep configuration; and
a plurality of conductive apertures defined by the fourth ledge.
6 . The semiconductor package of claim 5 , wherein the plurality of conductive apertures defined by the fourth ledge of the second substrate are mechanically connected and electrically connected to the plurality of conductive columns provided on the first ledge of the first substrate.
7 . The semiconductor package of claim 5 , wherein the plurality of conductive apertures defined by the second ledge of the first substrate are mechanically connected and electrically connected to the plurality of conductive columns provided on the third ledge of the second substrate.
8 . The semiconductor package of claim 5 , further comprising at least one electronic component electrically coupled to at least one of the third planar surface and the fourth planar surface.
9 . The semiconductor package of claim 8 , wherein the at least one electronic component electrically coupled to the at least one of the first planar surface and the second planar surface is a first type of electronic component and wherein the at least one electronic component electrically coupled to the at least one of the third planar surface and fourth planar surface is a second type of electronic component.
10 . The semiconductor package of claim 8 , wherein the at least one electronic component electrically coupled to the at least one of the first planar surface and the second planar surface is electrically coupled to the at least one electronic component electrically coupled to the at least one of the third planar surface and fourth planar surface.
11 . A method, comprising:
providing a first substrate section having a plurality conductive columns on a first lateral side;
providing a second substrate section having a plurality of conductive apertures defined by a second lateral side; and
interconnecting the first substrate section and the second substrate section by inserting the plurality of conductive columns on the first lateral side of the first substrate section into the plurality of conductive apertures defined by the second lateral side of the second substrate section.
12 . The method of claim 11 , wherein the first substrate section has a first electronic component and the second substrate section has a second electronic component.
13 . The method of claim 12 , wherein the first electronic component is a first type of electronic component and the second electronic component is a second type of electric component that is different from the first type of electronic component.
14 . The method of claim 12 , wherein the first electronic component is electrically coupled to the second electronic component.
15 . The method of claim 11 , wherein the plurality of conductive columns is comprised of a first conducting layer and wherein the plurality of conductive apertures is comprised of a second conducting layer.
16 . A semiconductor package, comprising:
a substrate, comprising:
a first ledge extending from a first lateral side, the first ledge and a first planar surface forming a first stairstep portion;
a plurality of first interconnection means extending from the first ledge;
a second ledge extending from a second lateral side, the second ledge and a second planar surface forming a second stairstep portion; and
a plurality of second interconnection means defined by the second ledge; and
at least one electronic component electrically coupled to the substrate.
17 . The semiconductor package of claim 16 , further comprising a three-dimensional (3D) printed enclosure means at least partially enclosing the at least one electronic component.
18 . The semiconductor package of claim 16 , further comprising at least one signal routing means extending from at least one of the plurality of first interconnection means.
19 . The semiconductor package of claim 16 , further comprising at least one signal routing means extending from at least one of the plurality of second interconnection means.
20 . The semiconductor package of claim 16 , wherein the substrate is a first substrate and wherein the semiconductor package further comprises a second substrate, the second substrate comprising:
a third planar surface;
a fourth planar surface opposite the third planar surface;
a third ledge extending from a first lateral side of the second substrate, the third ledge and the third planar surface forming a third stairstep configuration;
a plurality of conductive columns provided on the third ledge;
a fourth ledge extending from a second lateral side of the second substrate, the fourth ledge and the fourth planar surface forming a fourth stairstep configuration; and
a plurality of conductive apertures defined by the fourth ledge.