IP Library Patent Application 18963996
Patent Application Utility
App. No. 18/963,996 · Confirmation No. 3302

SELF-ALIGNED DIE-TO-WAFER BONDING ARCHITECTURE

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2026-06-04 NTC.PUB Notice of Publication 1 View
2025-02-10 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2025-02-10 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2025-02-04 PA.. Power of Attorney 1 View
2025-02-04 PA.. Power of Attorney 1 View
2025-02-04 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-12-12 APP.FILE.REC Filing Receipt 3 View
2024-12-12 WFEE Fee Worksheet (SB06) 1 View
2024-12-12 WELCOME.LET Welcome Letter from USPTO Director and Deputy Director 1 View
2024-11-29 DRW.SUPP Drawings-black and white line and/or other drawings View
2024-11-29 APP.TEXT Application body structured text document View
2024-11-29 SPEC Specification 22 View
2024-11-29 CLM Claims 3 View
2024-11-29 ABST Abstract 1 View
2024-11-29 N417.PYMT Electronic Fee Payment 2 View
2024-11-29 PA.. Power of Attorney 2 View
2024-11-29 OATH Oath or Declaration filed 3 View
2024-11-29 N417 Electronic Filing System Acknowledgment Receipt 2 View
2024-11-29 DRW Drawings-only black and white line drawings 9 View
2024-11-29 ADS Application Data Sheet 9 View
2024-11-29 SCORE Placeholder sheet indicating presence of supplemental content in Supplemental Complex Repository for Examiners(SCORE) 1 View
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Quick Facts
App. No.
18/963,996
Filed
2024-11-29
Pub. No.
US20260157224A1
Art Unit
OPAP