IP Library › Patent Application 63665731
Patent Application Provisional
App. No. 63/665,731 · Confirmation No. 4874

HIGH BANDWIDTH FLASH MEMORY CONTAINING A STACK OF BONDED LOGIC AND MEMORY DIE ASSEMBLIES AND METHODS FOR FORMING THE SAME

Provisional Application Expired
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Quick Facts
App. No.
63/665,731
Filed
2024-06-28