Patent Assignment
Reel/Frame 068879/0410
Assignment of Assignor's Interest
Recorded: 2024-10-11
Pages: 3
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Properties
(2)
High Bandwidth Flash Memory Containing a Stack of Bonded Logic and Memory Die Assemblies and Methods for Forming the Same
Application:
18/811,118 →
Publication:
US 2026/0006802
High Bandwidth Flash Memory Containing a Stack of Bonded Logic and Memory Die Assemblies and Methods for Forming the Same
Application:
63/665,731 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Security Agreement (Supplemental)
Nov 14, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0486 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →