Patent Assignment
Reel/Frame 004359/0541
Assignment of Assignors Interest.
Recorded: 1985-02-07
Pages: 1
Assignor
EMPAK INC.
Executed: 1984-12-20
Assignee
MONSANTO COMPANY
800 N. LINDBERGH BLVD., ST. LOUIS, MISSOURI, 63137
Covered Property
(1)
Package
Patent:
4,450,960 →
Application:
06/412,980 →
Related Assignments
(14)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignors Interest.
Aug 17, 1983
From: JOHNSON, DOUGLAS M.
To: EMPAK, 1501 PARK RD., A CORP. OF MN
Reel/Frame 004163/0058 →
Change of Name Effective Date: March 31, 1989
Apr 26, 1989
From: DNS ELECTRONIC MATERIALS, INC.
To: MEMC ELECTRONIC MATERIALS, INC.,
Reel/Frame 005146/0134 →
Assignment of Assignors Interest.
Apr 26, 1989
From: MONSANTO COMPANY
To: DNS ELECTRONIC MATERIALS, INC., A CORP. OF DE.
Reel/Frame 005069/0416 →
Assignment of Assignors Interest.
Mar 23, 1993
From: EMPAK, INC.
To: MARQUETTE BANK MINNEAPOLIS, N.A. AS AGENT
Reel/Frame 006467/0405 →
Assignment of Assignor's Interest
Jul 19, 1993
From: MARQUETTE BANK MINNEAPOLIS
To: EMPAK, INC.
Reel/Frame 006617/0987 →
Security Interest
Jul 19, 1993
From: EMPAK, INC.
To: MARQUETTE BANK GOLDEN VALLEY
Reel/Frame 006617/0973 →
Security Agreement
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012280/0161 →
Security Interest
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012273/0145 →
Termination of Security Interest
Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Interest
Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Security Agreement
Dec 28, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012365/0345 →
Security Agreement
Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →
Release of Security Interest
Aug 11, 2005
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016641/0045 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →