Patent Assignment
Reel/Frame 005146/0134
Change of Name Effective Date: March 31, 1989
Recorded: 1989-04-26
Pages: 1
Assignor
DNS ELECTRONIC MATERIALS, INC.
Executed: 1989-04-13
Assignee
Covered Properties
(19)
Apparatus and Method for Orienting Monocrystalline Material for Sawing
Patent:
4,002,410 →
Application:
05/559,194 →
Apparatus for Zone Refining
Patent:
4,201,746 →
Application:
05/806,139 →
Stabilizing and Supporting Apparatus for Float Zone Refined Semiconductor Crystal Rod
Patent:
4,257,841 →
Application:
05/867,640 →
Twin Blade Mounting and Tensioning Apparatus
Patent:
4,150,912 →
Application:
05/871,276 →
Rf Induction Heating Circuits for Float Zone Refining of Semiconductor Rods
Patent:
4,220,626 →
Application:
05/896,121 →
Method for Off-Orientation Point Rotation Sawing of Crystalline Rod Material
Patent:
4,228,578 →
Application:
06/003,563 →
Method and Apparatus for Wax Mounting of Thin Wafers for Polishing
Patent:
4,316,757 →
Application:
06/126,807 →
Apparatus for Improving Flatness of Polished Wafers
Patent:
4,313,284 →
Application:
06/134,714 →
Method for Producing Neutron Doped Silicon Having Controlled Dopant Variation
Patent:
4,348,351 →
Application:
06/142,310 →
Gas Curtain Continuous Chemical Vapor Deposition Production of Semiconductor Bodies
Patent:
4,309,241 →
Application:
06/172,503 →
Combination Gas Curtains for Continuous Chemical Vapor Deposition Production of Silicon Bodies
Patent:
4,444,812 →
Application:
06/172,509 →
Process for Increasing Silicon Thermal Decomposition Deposition Rates from Silicon Halide-Hydrogen Reaction Gases
Patent:
4,464,222 →
Application:
06/172,623 →
Temperature Control for Wafer Polishing
Patent:
4,450,652 →
Application:
06/299,378 →
Method of Regulating Concentration and Distribution of Oxygen in Czochralski Grown Silicon
Patent:
4,436,577 →
Application:
06/406,643 →
Package
Patent:
4,450,960 →
Application:
06/412,980 →
Denuding Silicon Substrates with Oxygen and Halogen
Patent:
4,666,532 →
Application:
06/607,349 →
Conditioned Semiconductor Substrates
Patent:
4,622,082 →
Application:
06/607,996 →
Gettering
Patent:
4,608,096 →
Application:
06/736,203 →
Furnace Contamination
Patent:
4,668,330 →
Application:
06/804,709 →
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Sep 4, 1981
From: WALSH, ROBERT J.
To: MONSANTO COMPANY
Reel/Frame 003917/0832 →
Assignment of Assignors Interest.
Aug 9, 1982
From: FREDERICK, ROGER A.; MOODY, JERRY W.
To: MONSANTO COMPANY, A CORP. OF DE.
Reel/Frame 004034/0012 →
Assignment of Assignors Interest.
Aug 17, 1983
From: JOHNSON, DOUGLAS M.
To: EMPAK, 1501 PARK RD., A CORP. OF MN
Reel/Frame 004163/0058 →
Assignment of Assignors Interest.
May 4, 1984
From: KORB, HAROLD W.; REED, CLAUDIA P.; SHAW, ROGER W.
To: MONSANTO COMPANY
Reel/Frame 004265/0164 →
Assignment of Assignors Interest.
Jun 25, 1984
From: DYSON, WILLIAM; ROSSI, JON A.
To: MONSANTO COMPANY A CORP OF DE
Reel/Frame 004294/0355 →
Assignment of Assignors Interest.
Feb 7, 1985
From: EMPAK INC.
To: MONSANTO COMPANY
Reel/Frame 004359/0541 →
Assignment of Assignors Interest.
Dec 5, 1985
From: GOLDEN, PAUL F.
To: MONSANTO COMPANY, ST. LOUIS, MISSOURI, A CORP OF DELAWARE
Reel/Frame 004495/0383 →
Assignment of Assignors Interest.
Apr 26, 1989
From: MONSANTO COMPANY
To: DNS ELECTRONIC MATERIALS, INC., A CORP. OF DE.
Reel/Frame 005069/0416 →
Assignment of Assignors Interest.
Mar 23, 1993
From: EMPAK, INC.
To: MARQUETTE BANK MINNEAPOLIS, N.A. AS AGENT
Reel/Frame 006467/0405 →
Security Interest
Jul 19, 1993
From: EMPAK, INC.
To: MARQUETTE BANK GOLDEN VALLEY
Reel/Frame 006617/0973 →
Assignment of Assignor's Interest
Jul 19, 1993
From: MARQUETTE BANK MINNEAPOLIS
To: EMPAK, INC.
Reel/Frame 006617/0987 →
Assignment of Assignor's Interest
Nov 28, 1997
From: MONSANTO COMPANY
To: SOLUTIA INC.
Reel/Frame 008820/0846 →
Security Agreement
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012280/0161 →
Security Interest
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012273/0145 →
Termination of Security Interest
Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Interest
Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Security Agreement
Dec 28, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012365/0345 →
Security Agreement
Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →
Release of Security Interest
Aug 11, 2005
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016641/0045 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →