Patent Assignment
Reel/Frame 004786/0176
Assignment of Assignors Interest.
Recorded: 1987-10-26
Pages: 2
Assignor
CLEMENTS, KEN
Executed: 1987-10-28
Covered Property
(1)
Semiconductor Wafer Array with Electrically Conductive Compliant Material
Patent:
4,954,875 →
Application:
07/114,633 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 28, 2004
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 015271/0057 →
Security Agreement
Oct 3, 2007
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 019910/0394 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCUITS, INC.
Reel/Frame 023148/0163 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCULTS, INC.
Reel/Frame 023148/0183 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →