IP Library › Assignment 023148/0163
Patent Assignment
Reel/Frame 023148/0163

Release

Recorded: 2009-08-27 Pages: 13
Assignor
SILICON VALLEY BANK
Executed: 2009-08-24
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, STE. 100, ATTN: FINANCE, SCOTTS VALLEY, CALIFORNIA, USA 65066
Covered Properties (24)
Semiconductor Wafer Array
Patent: 4,897,708 →
Application: 06/887,129 →
Semiconductor Wafer Array with Electrically Conductive Compliant Material
Patent: 4,954,875 →
Application: 07/114,633 →
Vertical Interconnect Process for Silicon Segments
Patent: 5,675,180 →
Application: 08/265,081 →
A Conductive Expoxy Flip-Chip Package and Method
Patent: 5,657,206 →
Application: 08/374,421 →
Silicon Segment Programming Method and Apparatus
Patent: 5,698,895 →
Application: 08/376,149 →
Vertical Interconnect Process for Silicon Segments
Patent: 5,661,087 →
Application: 08/476,623 →
Conductive Epoxy Flip-Chip Package and Method
Patent: 6,134,118 →
Application: 08/834,798 →
Vertical Interconnect Process for Silicon Segments
Patent: 6,188,126 →
Application: 08/842,448 →
Silicon Segment Programming Method
Patent: 5,994,170 →
Application: 08/845,654 →
Speaker Diaphragm
Patent: 5,936,302 →
Application: 08/845,655 →
Vertical Interconnect Process for Silicon Segments
Patent: 5,837,566 →
Application: 08/847,309 →
Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent: 6,255,726 →
Application: 08/915,620 →
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent: 6,098,278 →
Application: 08/917,447 →
Conductive Epoxy Flip-Chip on Chip
Patent: 6,271,598 →
Application: 08/918,500 →
Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent: 6,124,633 →
Application: 08/918,501 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent: 5,891,761 →
Application: 08/918,502 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent: 6,080,596 →
Application: 08/920,273 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent: 6,177,296 →
Application: 09/273,941 →
Silicon Segment Programming Apparatus and Three Terminal Fuse Configuration
Patent: 6,486,528 →
Application: 09/378,879 →
Three Dimensional Six Surface Conformal Die Coating
Patent: 7,705,432 →
Application: 11/016,558 →
Publication: US 2005/0224952
Stacked Die Bga or Lga Component Assembly
Patent: 7,215,018 →
Application: 11/090,969 →
Publication: US 2005/0230802
Micropede Stacked Die Component Assembly
Patent: 7,245,021 →
Application: 11/097,829 →
Publication: US 2005/0258530
Assembly Having Stacked Die Mounted on Substrate
Patent: 8,357,999 →
Application: 11/744,142 →
Publication: US 2007/0284716
Die Assembly Having Electrical Interconnect
Patent: 7,535,109 →
Application: 11/744,153 →
Publication: US 2007/0252262
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jul 17, 1986
From: CLEMENTS, KEN
To: LASER DYNAMICS INC., A CA. CORP.
Reel/Frame 004593/0034 →
Assignment of Assignors Interest. Oct 26, 1987
From: CLEMENTS, KEN
To: LASER DYNAMICS, INC., 170 TECHNOLOGY CIRCLE, SCOTTS VALLEY, CA 95066 A CORP. OF CA
Reel/Frame 004786/0176 →
Assignment of Assignor's Interest Sep 12, 1994
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007202/0568 →
Assignment of Assignor's Interest Apr 25, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007665/0192 →
Assignment of Assignor's Interest Apr 25, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007726/0715 →
Assignment of Assignor's Interest Jun 7, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007574/0844 →
Assignment of Assignor's Interest Feb 11, 1998
From: BLACK, LAWRENCE A.
To: ABBOTT LABORATORIES
Reel/Frame 009148/0743 →
Assignment of Assignor's Interest Mar 9, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009025/0041 →
Assignment of Assignor's Interest Mar 13, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009042/0380 →
Assignment of Assignor's Interest Mar 18, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009051/0093 →
Assignment of Assignor's Interest Mar 18, 1998
From: VINDASIUS, ALFONS; SAUTTER, M. KENNETH
To: CUBIC MEMORY, INC
Reel/Frame 009042/0952 →
Assignment of Assignor's Interest Mar 20, 1998
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 009057/0314 →
Assignment of Assignor's Interest Mar 23, 1998
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCHARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 009859/0818 →
Security Interest Apr 28, 2004
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 015271/0057 →
Assignment of Assignor's Interest Jan 15, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCHARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 018758/0309 →
Assignment of Assignor's Interest Feb 20, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; JACOBSEN, LARRY; ALMEN, DONALD
To: VERTICAL CIRCUITS, INC.
Reel/Frame 018912/0078 →
Assignment of Assignor's Interest Feb 20, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; JACOBSEN, LARRY; ALMEN, DONALD
To: VERTICAL CIRCUITS, INC.
Reel/Frame 018912/0039 →
Assignment of Assignor's Interest Feb 20, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 018909/0975 →
Security Agreement Oct 3, 2007
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 019910/0394 →
Release Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCULTS, INC.
Reel/Frame 023148/0183 →
Assignment of Assignor's Interest Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0970 →
Assignment of Assignor's Interest Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0991 →
Assignment of Assignor's Interest Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029627/0001 →
Assignment of Assignor's Interest Jan 10, 2013
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; JACOBSEN, LARRY; ALMEN, DONALD
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029627/0102 →