Patent Assignment
Reel/Frame 015271/0057
Security Interest
Recorded: 2004-04-28
Pages: 10
Assignor
VERTICAL CIRCUITS, INC.
Executed: 2002-11-20
Assignee
SILICON VALLEY BANK
3003 TASMAN DR., LOAN DOCUMENTATION HA 155, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(18)
Semiconductor Wafer Array
Patent:
4,897,708 →
Application:
06/887,129 →
Semiconductor Wafer Array with Electrically Conductive Compliant Material
Patent:
4,954,875 →
Application:
07/114,633 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,675,180 →
Application:
08/265,081 →
A Conductive Expoxy Flip-Chip Package and Method
Patent:
5,657,206 →
Application:
08/374,421 →
Silicon Segment Programming Method and Apparatus
Patent:
5,698,895 →
Application:
08/376,149 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,661,087 →
Application:
08/476,623 →
Conductive Epoxy Flip-Chip Package and Method
Patent:
6,134,118 →
Application:
08/834,798 →
Vertical Interconnect Process for Silicon Segments
Patent:
6,188,126 →
Application:
08/842,448 →
Silicon Segment Programming Method
Patent:
5,994,170 →
Application:
08/845,654 →
Speaker Diaphragm
Patent:
5,936,302 →
Application:
08/845,655 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,837,566 →
Application:
08/847,309 →
Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,255,726 →
Application:
08/915,620 →
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent:
6,098,278 →
Application:
08/917,447 →
Conductive Epoxy Flip-Chip on Chip
Patent:
6,271,598 →
Application:
08/918,500 →
Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,124,633 →
Application:
08/918,501 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
5,891,761 →
Application:
08/918,502 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,080,596 →
Application:
08/920,273 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,177,296 →
Application:
09/273,941 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Jul 17, 1986
From: CLEMENTS, KEN
To: LASER DYNAMICS INC., A CA. CORP.
Reel/Frame 004593/0034 →
Assignment of Assignors Interest.
Oct 26, 1987
From: CLEMENTS, KEN
To: LASER DYNAMICS, INC., 170 TECHNOLOGY CIRCLE, SCOTTS VALLEY, CA 95066 A CORP. OF CA
Reel/Frame 004786/0176 →
Assignment of Assignor's Interest
Sep 12, 1994
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007202/0568 →
Assignment of Assignor's Interest
Apr 25, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007726/0715 →
Assignment of Assignor's Interest
Apr 25, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007665/0192 →
Assignment of Assignor's Interest
Jun 7, 1995
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY
Reel/Frame 007574/0844 →
Assignment of Assignor's Interest
Feb 11, 1998
From: BLACK, LAWRENCE A.
To: ABBOTT LABORATORIES
Reel/Frame 009148/0743 →
Assignment of Assignor's Interest
Mar 9, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009025/0041 →
Assignment of Assignor's Interest
Mar 13, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009042/0380 →
Assignment of Assignor's Interest
Mar 18, 1998
From: VINDASIUS, ALFONS; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 009051/0093 →
Assignment of Assignor's Interest
Mar 18, 1998
From: VINDASIUS, ALFONS; SAUTTER, M. KENNETH
To: CUBIC MEMORY, INC
Reel/Frame 009042/0952 →
Assignment of Assignor's Interest
Mar 20, 1998
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 009057/0314 →
Assignment of Assignor's Interest
Mar 23, 1998
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCHARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 009859/0818 →
Assignment of Assignor's Interest
Jan 15, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCHARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 018758/0309 →
Security Agreement
Oct 3, 2007
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 019910/0394 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCUITS, INC.
Reel/Frame 023148/0163 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCULTS, INC.
Reel/Frame 023148/0183 →
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0970 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0991 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029627/0001 →
Change of Name
Jan 22, 2013
From: CUBIC MEMORY, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029674/0462 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →