Patent Assignment
Reel/Frame 009859/0818
Assignment of Assignor's Interest
Recorded: 1998-03-23
Pages: 3
Assignors
VINDASIUS, ALFONS
Executed: 1998-02-03
ROBINSON, MARC E.
Executed: 1998-02-03
SCHARRENBERG, WILLIAM R.
Executed: 1998-02-03
Assignee
CUBIC MEMORY, INC.
27 JANIS WAY, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent:
6,098,278 →
Application:
08/917,447 →
Related Assignments
(10)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 28, 2004
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 015271/0057 →
Assignment of Assignor's Interest
Jan 15, 2007
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; SCHARRENBERG, WILLIAM R.
To: CUBIC MEMORY, INC.
Reel/Frame 018758/0309 →
Security Agreement
Oct 3, 2007
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 019910/0394 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCUITS, INC.
Reel/Frame 023148/0163 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCULTS, INC.
Reel/Frame 023148/0183 →
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Change of Name
Jan 22, 2013
From: CUBIC MEMORY, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029674/0462 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →