Patent Assignment
Reel/Frame 009025/0041
Assignment of Assignor's Interest
Recorded: 1998-03-09
Pages: 2
Assignee
CUBIC MEMORY, INC.
27 JANIS WAY, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,080,596 →
Application:
08/920,273 →
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 28, 2004
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 015271/0057 →
Security Agreement
Oct 3, 2007
From: VERTICAL CIRCUITS, INC.
To: SILICON VALLEY BANK
Reel/Frame 019910/0394 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCUITS, INC.
Reel/Frame 023148/0163 →
Release
Aug 27, 2009
From: SILICON VALLEY BANK
To: VERTICAL CIRCULTS, INC.
Reel/Frame 023148/0183 →
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Change of Name
Jan 22, 2013
From: CUBIC MEMORY, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029674/0462 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →