Patent Assignment
Reel/Frame 004946/0417
Assignment of Assignors Interest.
Recorded: 1988-09-09
Pages: 3
Assignor
DISHON, GIORA J.
Executed: 1988-08-26
Covered Property
(1)
Method of Building Solder Bumps
Patent:
4,950,623 →
Application:
07/227,347 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Effective Date: May 10, 1990
Aug 3, 1990
From: MICROELECTRONICS CENTER OF NORTH CAROLINA
To: MCNC, A CORP. OF NC
Reel/Frame 005388/0923 →
Security Agreement
Dec 27, 2005
From: UNITIVE, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 016937/0710 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →