IP Library › Assignment 005388/0923
Patent Assignment
Reel/Frame 005388/0923

Change of Name Effective Date: May 10, 1990

Recorded: 1990-08-03 Pages: 5
Assignor
Assignee
Covered Properties (30)
Method and Apparatus for Exposing Photoresist by Using an Electron Beam and Controlling Its Voltage and Charge
Patent: 4,576,884 →
Application: 06/620,510 →
Apparatus for Mounting a Semiconductor Chip and Making Electrical Connections Thereto
Patent: 4,774,630 →
Application: 06/781,981 →
A Method of Interconnecting Wiring Planes
Patent: 4,667,404 →
Application: 06/781,982 →
Shared Current Loop, Multiple Field Apparatus and Process for Plasma Processing
Patent: 4,738,761 →
Application: 06/916,007 →
Method and Apparatus for Processing Multi-Dimensional Data to Obtain a Fourier Transform
Patent: 4,821,224 →
Application: 06/926,436 →
Microelectronics Apparatus
Patent: 4,764,644 →
Application: 07/017,628 →
Method for Anisotropically Hardening a Protective Coating for Integrated Circuit Manufacture
Patent: 4,826,754 →
Application: 07/042,932 →
Structure and Method for Isolated Voltage Referenced Transmission Lines of Substrates with Isolated Reference Planes
Patent: 4,816,616 →
Application: 07/131,183 →
Wand Optics Column and Associated Array Wand and Charged Particle Source
Patent: 4,902,898 →
Application: 07/186,510 →
Photoresists Resistant to Oxygen Plasmas
Patent: 4,968,582 →
Application: 07/212,440 →
Circuit to Perform Variable Threshold Logic
Patent: 4,896,059 →
Application: 07/224,334 →
Method of Building Solder Bumps
Patent: 4,950,623 →
Application: 07/227,347 →
Metallization Process for an Integrated Circuit
Patent: 4,897,287 →
Application: 07/254,252 →
High Performance Integrated Circuit Chip Package and Method of Making Same
Application: 07/270,729 →
Method of Forming a Nonsilicon Semiconductor on Insulator Structure
Patent: 4,891,329 →
Application: 07/277,168 →
High Density Semiconductor Structure and Method of Making the Same
Patent: 5,025,304 →
Application: 07/277,607 →
Metal-To-Metal Bonding Method and Resulting Structure
Application: 07/277,620 →
Fluxless Soldering Process
Patent: 4,921,157 →
Application: 07/324,247 →
Self-Aligned Salicide Process for Forming Semiconductor Devices and Devices Formed Thereby
Patent: 5,001,082 →
Application: 07/337,187 →
Bonding of Ceramic Parts
Patent: 5,098,494 →
Application: 07/356,005 →
Method and Apparatus for High Precision Weighted Random Pattern Generation
Patent: 5,043,988 →
Application: 07/398,772 →
Method for Selectively Depositing Single Elemental Semiconductor Material on Substrates
Patent: 5,037,775 →
Application: 07/402,794 →
Electrostatic Handling Device
Patent: 5,001,594 →
Application: 07/403,755 →
Photoresists Resistant to Oxygen Plasmas
Application: 07/424,663 →
Passivated Polycrystalline Semiconductors Quantum Well/Superlattice Structures Fabricated Thereof
Patent: 5,051,786 →
Application: 07/426,571 →
Method for Anisotropically Hardening a Protective Coating for Integrated Circuit Manufacture
Patent: 5,064,748 →
Application: 07/454,759 →
Metal-To-Metal Bonding Method and Resulting Structure
Patent: 5,009,360 →
Application: 07/486,064 →
Maximum Areal Density Recessed Oxide Isolation (Madrox) Process
Patent: 5,039,625 →
Application: 07/516,246 →
Magnetron Method and Apparatus for Producing High Density Ionic Gas Discharge
Patent: 5,045,166 →
Application: 07/526,572 →
Self-Aligned Electron Emitter Fabrication Method and Devices Formed Thereby
Patent: 5,126,287 →
Application: 07/534,711 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Jun 14, 1984
From: REISMAN, ARNOLD
To: MICROELECTRONICS CENTER RESEARCH TRIANGLE PARK NORTH CAROLINA A NON-PROFIT CORP OF
Reel/Frame 004275/0230 →
Assignment of Assignors Interest. Sep 30, 1985
From: REISMAN, ARNOLD; OSBURN, CARLTON M.; HWANG, LIH-TYNG; NARAYAN, JAGDISH
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, A NON-PROFIT NORTH CAROLINA CORPORATION
Reel/Frame 004464/0281 →
Assignment of Assignors Interest. Nov 25, 1985
From: REISMAN, ARNOLD; OSBURN, CARLTON M.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, A NON-PROFIT NORTH CAROLINA CORPORATION
Reel/Frame 004512/0864 →
Assignment of Assignors Interest. Dec 10, 1987
From: JONES, GARY W.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA
Reel/Frame 004806/0961 →
Assignment of Assignors Interest. Jun 23, 1988
From: JONES, GARY W.; JONES, SUSAN K. S.
To: MICROELECTRONICS CENTER, A NONPROFIT NC CORP.
Reel/Frame 004903/0402 →
Assignment of Assignors Interest. Jul 19, 1988
From: GOODWIN-JOHANSSON, SCOTT
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, RESEARCH TRIANGLE PARK, NORTH CAROLINA
Reel/Frame 004919/0580 →
Assignment of Assignors Interest. Sep 9, 1988
From: DISHON, GIORA J.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, RESEARCH TRIANGLE PARK, DURHAM, NORTH CAROLINA A NON-PROFIT NORTH CAROLINA CORP.
Reel/Frame 004946/0417 →
Assignment of Assignors Interest. Oct 6, 1988
From: BERGER, HENRY R.; ADEMA, GRETCHEN M.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, P.O. BOX 12889, RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709 A NON-PROFIT NORTH CAROLINA CORP.; BOC GROUP, INC., THE, 85 CHESTNUT RIDGE ROAD, MONTVALE, NEW JERSEY 07645, A DE. CORP.
Reel/Frame 004949/0456 →
Assignment of Assignors Interest. Jan 25, 1989
From: TURLIK, IWONA
To: BELL NORTHERN RESEARCH, INC., A CORP. OF NC
Reel/Frame 005002/0986 →
Assignment of Assignors Interest. Jan 25, 1989
From: REISMAN, ARNOLD; NAYAK, DEEPAK
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, A CORP. OF NC
Reel/Frame 005002/0983 →
Assignment of Assignors Interest. Feb 2, 1989
From: NAYAK, DEEPAK
To: MICROELECTRONICS CENTER OF NORTH CAROLINA
Reel/Frame 005023/0757 →
Assignment of Assignors Interest. Feb 2, 1989
From: REISMAN, ARNOLD
To: MICROELECTRONICS CENTER OF NORTH CAROLINA
Reel/Frame 005023/0751 →
Assignment of Assignors Interest. Feb 2, 1989
From: BOBBIO, STEPHEN M.; JONES, SUSAN K. S.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, A NON-PROFIT NC CORP.
Reel/Frame 005013/0341 →
Assignment of Assignors Interest. Feb 2, 1989
From: TRANJAN, FARID M.; DU BOIS, THOMAS D.; FRIESER, RUDOLF G.
To: NORTH CAROLINA, UNIVERSITY OF AT CHARLOTTE, THE
Reel/Frame 005013/0344 →
Assignment of Assignors Interest. Feb 2, 1989
From: POLEY, NEIL M.
To: IBM CORPORATION
Reel/Frame 005023/0754 →
Assignment of Assignors Interest. Feb 2, 1989
From: TURLIK, IWONA
To: BELL NORTHERN RESEARCH, INC.
Reel/Frame 005023/0747 →
Assignment of Assignors Interest. Feb 2, 1989
From: DISHON, GIORA
To: MICROELECTRONICS CENTER OF NORTH CAROLINA
Reel/Frame 005023/0745 →
Assignment of Assignors Interest. Feb 2, 1989
From: JACOBS, SCOTT L.
To: IBM CORPORATION
Reel/Frame 005023/0742 →
Assignment of Assignors Interest. Feb 27, 1989
From: REISMAN, ARNOLD
To: MICROELECTRONICS CENTER OF NORTH CAROLINA
Reel/Frame 005027/0094 →
Assignment of Assignors Interest. Feb 27, 1989
From: CHU, WEI-KEN
To: UNIVERSITY OF NORTH CAROLINA AT CHAPEL HILL
Reel/Frame 005027/0108 →
Assignment of Assignors Interest. Mar 15, 1989
From: BOBBIO, STEPHEN M.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA,
Reel/Frame 005054/0637 →
Assignment of Assignors Interest. Mar 15, 1989
From: DISHON, GIORA
To: MICROELECTRONICS CENTER OF NORTH CAROLINA,
Reel/Frame 005054/0640 →
Assignment of Assignors Interest. Apr 12, 1989
From: GOODWIN-JOHANSSON, SCOTT H.
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, RESEARCH TRIANGLE PARK, NC,A NC NON-PROFIT CORP.
Reel/Frame 005062/0790 →
Assignment of Assignors Interest. May 23, 1989
From: REISMAN, ARNOLD
To: MICROELECTRONICS CENTER OF NORTH CAROLINA, A NON-PROFIT CORP. OF NC
Reel/Frame 005085/0757 →
Assignment of Assignors Interest. Jun 26, 1989
From: TURLIK, IWONA
To: BNR INC.
Reel/Frame 005169/0527 →