Patent Assignment
Reel/Frame 007228/0869
Assignment of Assignor's Interest
Recorded: 1994-11-28
Pages: 2
Assignor
KOSE, YASUSHI
Executed: 1994-11-21
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Bonding Structure of Dielectric Substrates for Impedance Matching Circuits on a Packaging Substrate Involved in Microwave Integrated Circuits
Patent:
5,477,085 →
Application:
08/348,822 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 31, 2003
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013852/0613 →
Assignment of Assignor's Interest
Apr 4, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017422/0528 →
Change of Name
Oct 21, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025172/0931 →