IP Library › Assignment 013852/0613
Patent Assignment
Reel/Frame 013852/0613

Assignment of Assignor's Interest

Recorded: 2003-03-31 Pages: 4
Assignor
NEC CORPORATION
Executed: 2002-09-19
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8666, JAPAN
Covered Properties (48)
Method of Fabricating a Multi-Layer Gate Electrode with Annealing Step
Patent: 5,459,087 →
Application: 08/101,353 →
Multi-Quantum Well (Mqw) Structure Laser Diode/Modulator Integrated Light Source
Patent: 5,519,721 →
Application: 08/204,454 →
Method for Manufacturing Semiconductor Device Having Bipolar Transistor and Polycrystalline Silicon Resistor
Patent: 5,420,053 →
Application: 08/237,995 →
Substrate with a Compound Semiconductor Surface Layer and Method for Preparing the Same
Patent: 5,548,136 →
Application: 08/272,041 →
Semiconductor Photocoupler with Changing Capacitance
Patent: 5,459,336 →
Application: 08/286,908 →
Optoelectronic Device
Patent: 5,504,349 →
Application: 08/290,503 →
Method and Equipment for Manufacturing a Semiconductor Device
Patent: 5,492,864 →
Application: 08/294,727 →
Semiconductor Mesfet Device with Edge Portion
Patent: 5,504,352 →
Application: 08/347,154 →
Bonding Structure of Dielectric Substrates for Impedance Matching Circuits on a Packaging Substrate Involved in Microwave Integrated Circuits
Patent: 5,477,085 →
Application: 08/348,822 →
Optical Modulator and Method of Producing the Same
Patent: 5,543,957 →
Application: 08/358,622 →
Avalanche Photo-Diode for Producing Sharp Pulse Signal
Patent: 5,569,942 →
Application: 08/494,556 →
Method for Fabricating a Bipolar Transistor with a Base Layer Having an Extremely Low Resistance
Patent: 5,648,280 →
Application: 08/533,850 →
Semiconductor Device for Mounting High-Frequency Element
Patent: 5,635,759 →
Application: 08/558,089 →
High-Frequency Amplifier Having Variable Gain in Response to Input Power Level
Patent: 5,789,983 →
Application: 08/604,238 →
Semiconductor Laser Having an Improved Lateral Carrier Injection Structure to Multiple Quantum Well Layers
Patent: 5,956,358 →
Application: 08/606,314 →
Optical Semiconductor Device
Patent: 5,753,933 →
Application: 08/611,674 →
Laser Diode with an Improved Multiple Quantum Well Structure Adopted for Reduction in Wavelength Chirping
Patent: 5,790,578 →
Application: 08/625,345 →
Semiconductor Photo Detector
Patent: 5,656,831 →
Application: 08/625,364 →
Field Effect Transistor and Method of Fabricating the Same
Patent: 6,373,081 →
Application: 08/630,128 →
Nhort Wavelength Laser Emitting Diode with an Improved Gan System Double Heterostructure
Patent: 5,742,628 →
Application: 08/650,439 →
Phase Synchronous Circuit
Patent: 5,686,865 →
Application: 08/664,005 →
Equipment for Manufacturing a Semiconductor Device Using a Solid Source
Patent: 5,662,742 →
Application: 08/723,985 →
Bipolar Transistor Having an Improved Epitaxial Base Region
Patent: 5,789,800 →
Application: 08/785,611 →
High Frequency Switching Circuit
Patent: 5,883,541 →
Application: 08/811,931 →
Gas Pressure Regulation in Vapor Deposition
Patent: 6,017,395 →
Application: 08/816,329 →
Electro-Absorption Type Semiconductor Optical Modulator Having a Quantum Well Structure
Patent: 6,100,543 →
Application: 08/865,808 →
Semiconductor Light-Receiving Device with Inclined Multlayer Structure
Patent: 6,020,620 →
Application: 08/886,164 →
Method of Forming an Opening in an Insulation Film Over a Semiconductor Substrate
Patent: 6,027,993 →
Application: 08/966,866 →
Optical Semiconductor Device and Method of Fabricating the Same
Patent: 6,167,070 →
Application: 08/986,249 →
Laser Diode with an Improved Multiple Quantum Well Structure Adopted for Reduction in Wavelength Chirping
Patent: 6,111,904 →
Application: 09/002,401 →
A Catalytic Deposition Method for a Semiconductor Surface Passivation Film
Patent: 6,225,241 →
Application: 09/007,543 →
Method of Forming Chip Semiconductor Devices
Patent: 6,077,757 →
Application: 09/020,789 →
Semiconductor Device
Patent: 5,852,318 →
Application: 09/025,998 →
Lead Frame for Face-Down Bonding
Patent: 6,018,189 →
Application: 09/052,156 →
Compound Semiconductor Device Having a Multilayer Silicon Structure Between an Active Region and Insulator Layer for Reducing Surface State Density at Interface
Patent: 5,942,792 →
Application: 09/071,492 →
Mobile Communication Transmitter Capable of Selectively Activating Amplifiers
Patent: 6,215,987 →
Application: 09/090,883 →
Miniaturization of a Semiconductor Chip
Patent: 6,222,266 →
Application: 09/145,235 →
Molecular Beam Epitaxial Growth Method
Patent: 6,099,640 →
Application: 09/146,102 →
Semiconductor Laser Having an Improved Current Blocking Layers and Method of Forming the Same
Patent: 6,345,064 →
Application: 09/188,204 →
Optical Fiber Secured with a Photosetting Resin Covered with a Uv Light-Transmissive Plate
Patent: 6,130,444 →
Application: 09/249,577 →
Plural Transistor Device with Multi-Finger Structure
Patent: 6,346,728 →
Application: 09/249,579 →
Process for Production of Semiconductor Laser Grating
Patent: 6,228,671 →
Application: 09/315,966 →
Semiconductor Photodetector with an Increased Photo Receiving Area and Exhibiting High Speed Performances
Patent: 6,271,546 →
Application: 09/333,886 →
Fabricating Method of Optical Semiconductor Device
Patent: 6,399,404 →
Application: 09/407,091 →
Publication: US 2001/0041379
Semiconductor Device Having a Photosensitive Organic Film, and Process for Producing the Same
Patent: 6,100,555 →
Application: 09/432,128 →
Semiconductor Light-Receiving Device and Method of Fabricating the Same
Patent: 6,232,141 →
Application: 09/455,771 →
Optical Semiconductor Device and Method of Fabricating the Same
Patent: 6,383,829 →
Application: 09/667,524 →
Microwave Amplifier Generating Distortion-Reduced High Output Microwave Power
Patent: 6,396,342 →
Application: 09/686,806 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 26, 1993
From: MOCHIZUKI, AKIRA
To: NEC CORPORATION
Reel/Frame 006744/0330 →
Assignment of Assignor's Interest May 4, 1994
From: MIYAZAKI, SHINICHI
To: NEC CORPORATION
Reel/Frame 006999/0046 →
Assignment of Assignor's Interest Jul 5, 1994
From: TAKANO, SHINJI
To: NEC CORPORATION
Reel/Frame 007052/0346 →
Assignment of Assignor's Interest Aug 15, 1994
From: YOSHINO, TAKASHI
To: NEC CORPORATION
Reel/Frame 007127/0195 →
Assignment of Assignor's Interest Aug 22, 1994
From: SAITOH, YOSHIHARU
To: NEC CORPORATION
Reel/Frame 007131/0402 →
Assignment of Assignor's Interest Nov 22, 1994
From: TSUTSUI, HIROAKI; MOCHIZUKI, AKIRA
To: NEC CORPORATION
Reel/Frame 007227/0978 →
Assignment of Assignor's Interest Nov 28, 1994
From: KOSE, YASUSHI
To: NEC CORPORATION
Reel/Frame 007228/0869 →
Assignment of Assignor's Interest Dec 14, 1994
From: KOUI, TOMOAKI; TAKANO, SHINJI
To: NEC CORPORATION
Reel/Frame 007300/0321 →
Assignment of Assignor's Interest Dec 19, 1994
From: ASAI, SHUJI
To: NEC CORPORATION
Reel/Frame 007253/0098 →
Assignment of Assignor's Interest Jun 22, 1995
From: KUSAKABE, ATSUHIKO
To: NEC CORPORATION
Reel/Frame 007576/0212 →
Assignment of Assignor's Interest Nov 13, 1995
From: NEGISHI, HITOSHI
To: NEC CORPORATION
Reel/Frame 007789/0987 →
Assignment of Assignor's Interest Feb 21, 1996
From: FUJITA, MASANORI
To: NEC CORPORATION
Reel/Frame 007886/0615 →
Assignment of Assignor's Interest Mar 4, 1996
From: KATO, HIROSI
To: NEC CORPORATION
Reel/Frame 007839/0414 →
Assignment of Assignor's Interest Apr 10, 1996
From: MORIKAWA, JUNKO; TAKAHASHI, HIDEMASA; ASANO, KAZUNORI
To: NEC CORPORATION
Reel/Frame 007963/0428 →
Assignment of Assignor's Interest May 20, 1996
From: FUJII, HIROAKI
To: NEC CORPORATION
Reel/Frame 008057/0234 →
Assignment of Assignor's Interest May 22, 1996
From: MORIMOTO, TAKAO
To: NEC CORPORATION
Reel/Frame 007959/0857 →
Assignment of Assignor's Interest Jun 14, 1996
From: TAKEUCHI, HIROSHI
To: NEC CORPORATION
Reel/Frame 008247/0540 →
Assignment of Assignor's Interest Jun 21, 1996
From: SASAKI, YOSHIHIRO
To: NEC CORPORATION
Reel/Frame 008131/0020 →
Assignment of Assignor's Interest Jul 10, 1996
From: KUSAKABE, ATSUHIKO
To: NEC CORPORATION
Reel/Frame 008029/0791 →
Assignment of Assignor's Interest Jul 15, 1996
From: TAKANO, SHINIJI
To: NEC CORPORATION
Reel/Frame 008047/0251 →
Assignment of Assignor's Interest Sep 27, 1996
From: KOHNO, HIROSHI
To: NEC CORPORATION
Reel/Frame 008263/0806 →
Assignment of Assignor's Interest Jan 17, 1997
From: KOHNO, HIROSHI
To: NEC CORPORATION
Reel/Frame 008388/0195 →
Assignment of Assignor's Interest Aug 4, 1997
From: TAHARA, KAZUHIRO; MIYA, TATSUYA
To: NEC CORPORATION
Reel/Frame 008635/0445 →
Assignment of Assignor's Interest Sep 5, 1997
From: MATUNO, SHUNICHI; KAKIMOTO, YOSHIYUKI
To: NEC CORPORATION
Reel/Frame 008716/0135 →
Assignment of Assignor's Interest Jan 2, 1998
From: GERRY BABY PRODUCTS COMPANY
To: LISCO, INC.
Reel/Frame 008975/0003 →