Patent Assignment
Reel/Frame 009052/0185
Assignment of Assignor's Interest
Recorded: 1998-03-16
Pages: 9
Assignor
MICRON ELECTRONICS, INC.
Executed: 1998-02-24
Assignee
MICRON CUSTOM MANUFACTURING SERVICES
16399 FRANKLIN ROAD, NAMPA, IDAHO, 83687
Covered Properties
(32)
Vibrational Method of Aligning the Leads of Surface-Mount Electronic Components with the Mounting Pads of Printed Circuit Boards During the Molten Solder Mounting Process
Patent:
4,885,841 →
Application:
07/313,221 →
Semiconductor Pick-and-Place Machine Calibration Apparatus
Patent:
5,247,844 →
Application:
07/783,111 →
Semiconductor Pick-and-Place Machine Automatic Calibration Apparatus
Patent:
5,237,622 →
Application:
07/802,310 →
Fixture for Alignment of Vacuum Nozzles on Semiconductor Manufacturing Equipment
Patent:
5,433,013 →
Application:
08/126,824 →
Method Employing an Elevating of Atmospheric Pressure During the Heating and/or Cooling Phases of Ball Grid Array (Bga) Soldering of an Ic Device to a Pcb
Patent:
5,385,291 →
Application:
08/179,396 →
Angled Pallets for Wave Soldering
Patent:
5,540,376 →
Application:
08/324,087 →
Automatic Optical Pick and Place Calibration and Capability Analysis System for Assembly of Components Onto Printed Circuit Boards
Patent:
5,537,204 →
Application:
08/408,081 →
Fixture for Alignment of Vacuum Nozzles on Semiconductor Manufacturing Equipment
Patent:
5,539,992 →
Application:
08/421,707 →
Shield and Method for Selective Wave Soldering
Patent:
5,617,990 →
Application:
08/498,670 →
Thermal Box for a Semiconductor Test System
Patent:
5,892,367 →
Application:
08/553,763 →
Actuator Stem and Actuator Design Having a D-Shaped Cross-Section
Patent:
5,755,471 →
Application:
08/602,346 →
Module Handling Apparatus and Method with Rapid Switchover Capability
Patent:
5,667,077 →
Application:
08/639,354 →
Wave Solder Method for Attaching Components to a Printed Circuit Board
Patent:
5,775,568 →
Application:
08/686,781 →
Fixture for Testing and Prepping Light-Emitting Diodes
Patent:
5,793,220 →
Application:
08/695,613 →
Apparatus for Depositing Solder and Adhesive Materials Onto a Printed Circuit Board
Patent:
5,740,730 →
Application:
08/706,448 →
Universal Testing Device for Electronic Modules with Different Configurations and Operating Parameters
Patent:
5,757,201 →
Application:
08/712,371 →
Universal Fixture for Holding Printed Circuit Boards During Processing
Patent:
5,779,794 →
Application:
08/761,701 →
Apparatus for Preserving Solder Paste in the Manufacturing of Printed Circuit Board Assemblies
Patent:
5,876,498 →
Application:
08/772,155 →
Multiple Access Memory Device
Patent:
5,784,331 →
Application:
08/775,664 →
Air Bladder Fixture Tooling for Supporting Circuit Board Assembly Processing
Patent:
5,820,117 →
Application:
08/800,069 →
Shield and Method for Selective Wave Soldering
Patent:
5,704,535 →
Application:
08/801,996 →
Universal Fixture for Supporting and Holding Populated Sides of Printed Circuit Board Assemblies During Processing
Patent:
5,932,065 →
Application:
08/833,914 →
Alignment Fixture for Solder-Wave Machines
Patent:
6,119,915 →
Application:
08/852,335 →
Apparatus for Holding Printed Circuit Board Assemblies in Manufacturing Processes
Patent:
5,984,293 →
Application:
08/882,479 →
Module Handling Apparatus and Method with Rapid Switchover Capability
Patent:
5,931,311 →
Application:
08/891,954 →
Apparatus for Calibrating Surface Mounting Processes in Printed Circuit Board Assembly Manufacturing
Patent:
5,942,078 →
Application:
08/895,765 →
Method for Calibrating Surface Mounting Processes in Printed Circuit Board Assembly Manufacturing
Patent:
5,978,093 →
Application:
08/895,766 →
Method of Attaching a Device to a Circuit Board
Patent:
6,610,430 →
Application:
08/896,412 →
Solder Paste Brick
Patent:
6,114,769 →
Application:
08/897,093 →
Method of Providing Electrical Contact to Component Leads
Patent:
5,874,323 →
Application:
08/919,536 →
Carrier Socket for Receiving a Damaged Ic
Patent:
5,910,024 →
Application:
08/919,626 →
Method for Supporting Printed Circuit Board Assemblies
Patent:
5,964,031 →
Application:
08/926,139 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Feb 21, 1989
From: MC NABB, JOHN P.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 005047/0247 →
Assignment of Assignors Interest.
Jul 10, 1989
From: MC NABB, JOHN P.
To: MICRON TECHNOLOGY, INC., A CORP. OF DE
Reel/Frame 005161/0180 →
Assignment of Assignors Interest.
Oct 25, 1991
From: HOWELL, DAVID A.
To: MICRON TECHNOLOGY, INC., A CORP.OF DE
Reel/Frame 005899/0668 →
Assignment of Assignors Interest.
Dec 4, 1991
From: HOWELL, DAVID A.
To: MICRON TECHNOLOGY, INC. A CORP. OF DELAWARE
Reel/Frame 005937/0045 →
Security Interest
Aug 21, 1992
From: REMINGTON PRODUCTS COMPANY
To: PROVIDENT BANK, THE
Reel/Frame 006241/0395 →
Assignment of Assignor's Interest
Sep 24, 1993
From: WOODHOUSE, GLENN P.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 006695/0207 →
Assignment of Assignor's Interest
Dec 20, 1993
From: MICRON TECHNOLOGY, INC.
To: MICRON SEMICONDUCTOR, INC.
Reel/Frame 006806/0257 →
Assignment of Assignor's Interest
Jan 10, 1994
From: LATTA, RICHARD W.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 006857/0739 →
Assignment of Assignor's Interest
Aug 8, 1994
From: MICRON TECHNOLOGY, INC.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007091/0945 →
Assignment of Assignor's Interest
Aug 8, 1994
From: MICRON TECHNOLOGY, INC.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007090/0693 →
Assignment of Assignor's Interest
Aug 16, 1994
From: MICRON SEMICONDUCTOR, INC.
To: MICRON CUSTOM MANUFACTURING SERVIES, INC.
Reel/Frame 007103/0476 →
Assignment of Assignor's Interest
Oct 14, 1994
From: ASLA, JESS; LANGE, ROY; DESPAIN, RON
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007192/0071 →
Assignment of Assignor's Interest
Mar 20, 1995
From: WOODHOUSE, GLENN P.
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007393/0479 →
Assignment of Assignor's Interest
Jul 3, 1995
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC.
Reel/Frame 007574/0089 →
Assignment of Assignor's Interest
Oct 23, 1995
From: MAGEE, ALLAN; CREED, ROBERT; LOISATE, STEVE
To: MICRON CUSTOM MANUFACTURING SERVICES, INC.
Reel/Frame 007729/0436 →
Merger and Change of Name
Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC. A MINNESOTA CORP.
Reel/Frame 007980/0499 →
Merger and Change of Name
Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MN CORP.
Reel/Frame 007860/0298 →
Merger and Change of Name
Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MINNESOTA CORP.
Reel/Frame 007848/0603 →
Merger and Change of Name
Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS INC., A MN CORP.
Reel/Frame 007838/0238 →
Merger and Change of Name
Feb 29, 1996
From: MICRON CUSTOM MANUFACTURING SERVICES, INC.
To: MICRON ELECTRONICS, INC., A MN CORP.
Reel/Frame 008240/0705 →
Assignment of Assignor's Interest
May 1, 1996
From: BJORKLUND, JAMES M.; BANNER, BRYAN K.
To: MICRON ELECTRONICS, INC.
Reel/Frame 007918/0271 →
Assignment of Assignor's Interest
Jul 12, 1996
From: GOINS, FRED, III
To: MICRON ELECTRONICS, INC.
Reel/Frame 008062/0674 →
Assignment of Assignor's Interest
Aug 12, 1996
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC
Reel/Frame 008163/0849 →
Assignment of Assignor's Interest
Sep 3, 1996
From: THOMPSON, CURTIS C., SR.
To: MICRON ELECTRONICS, INC.
Reel/Frame 008152/0034 →
Assignment of Assignor's Interest
Sep 11, 1996
From: PARTRIDGE, FRANK E.; LOISATE, STEVE
To: MICRON ELECTRONICS, INC
Reel/Frame 008228/0990 →