Patent Assignment
Reel/Frame 010260/0152
Assignment of Assignor's Interest
Recorded: 1999-09-15
Pages: 4
Assignees
NEC CORPORATION
7-1, SHIBA, 5-CHOME, MINATO-KU, TOKYO, JAPAN
FUCHIGAMI MICRO CO., LTD.
3-1, NAN'EI, KAGOSHIMA-SHI, KAGOSHIMA, JAPAN
Covered Property
(1)
Multilayered Circuit Board for Semiconductor Chip Module, and Method of Manufacturing the Same
Patent:
6,555,763 →
Application:
09/397,016 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 4, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013549/0709 →
Assignment of Assignor's Interest
Apr 25, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017811/0452 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0948 →
Assignment of Assignor's Interest
Jul 2, 2015
From: FUCHIGAMI MICRO CO., LTD.
To: MOLEX KIIRE CO., LTD.
Reel/Frame 035973/0001 →
Assignment of Assignor's Interest
Sep 4, 2015
From: MOLEX KIIRE CO., LTD.
To: MOLEX, LLC
Reel/Frame 036495/0209 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →