Patent Assignment
Reel/Frame 035973/0001
Assignment of Assignor's Interest
Recorded: 2015-07-02
Pages: 4
Assignor
FUCHIGAMI MICRO CO., LTD.
Executed: 2015-06-26
Assignee
MOLEX KIIRE CO., LTD.
11620-45 KIIRE, HITOKURA-CHO, KAGOSHIMA, 891-0204, JAPAN
Covered Property
(1)
Multilayered Circuit Board for Semiconductor Chip Module, and Method of Manufacturing the Same
Patent:
6,555,763 →
Application:
09/397,016 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 15, 1999
From: HIRASAWA, KOKI; ONO, TERUO
To: NEC CORPORATION; FUCHIGAMI MICRO CO., LTD.
Reel/Frame 010260/0152 →
Assignment of Assignor's Interest
Dec 4, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013549/0709 →
Assignment of Assignor's Interest
Apr 25, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017811/0452 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0948 →
Assignment of Assignor's Interest
Sep 4, 2015
From: MOLEX KIIRE CO., LTD.
To: MOLEX, LLC
Reel/Frame 036495/0209 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →