Patent Assignment
Reel/Frame 013549/0709
Assignment of Assignor's Interest
Recorded: 2002-12-04
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-11-14
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8666, JAPAN
Covered Property
(1)
Multilayered Circuit Board for Semiconductor Chip Module, and Method of Manufacturing the Same
Patent:
6,555,763 →
Application:
09/397,016 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 15, 1999
From: HIRASAWA, KOKI; ONO, TERUO
To: NEC CORPORATION; FUCHIGAMI MICRO CO., LTD.
Reel/Frame 010260/0152 →
Assignment of Assignor's Interest
Apr 25, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017811/0452 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0948 →
Assignment of Assignor's Interest
Jul 2, 2015
From: FUCHIGAMI MICRO CO., LTD.
To: MOLEX KIIRE CO., LTD.
Reel/Frame 035973/0001 →
Assignment of Assignor's Interest
Sep 4, 2015
From: MOLEX KIIRE CO., LTD.
To: MOLEX, LLC
Reel/Frame 036495/0209 →