IP Library › Assignment 017811/0452
Patent Assignment
Reel/Frame 017811/0452

Assignment of Assignor's Interest

Recorded: 2006-04-25 Pages: 3
Assignor
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Multilayered Circuit Board for Semiconductor Chip Module, and Method of Manufacturing the Same
Patent: 6,555,763 →
Application: 09/397,016 →
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 15, 1999
From: HIRASAWA, KOKI; ONO, TERUO
To: NEC CORPORATION; FUCHIGAMI MICRO CO., LTD.
Reel/Frame 010260/0152 →
Assignment of Assignor's Interest Dec 4, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013549/0709 →
Change of Name Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0948 →
Assignment of Assignor's Interest Jul 2, 2015
From: FUCHIGAMI MICRO CO., LTD.
To: MOLEX KIIRE CO., LTD.
Reel/Frame 035973/0001 →
Assignment of Assignor's Interest Sep 4, 2015
From: MOLEX KIIRE CO., LTD.
To: MOLEX, LLC
Reel/Frame 036495/0209 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →