IP Library Assignment 011493/0697
Patent Assignment
Reel/Frame 011493/0697

Assignment of Assignor's Interest

Recorded: 2001-01-16 Pages: 3
Assignor
KAY, YUEN YEW
Executed: 2001-01-05
Assignee
ST ASSEMBLY TEST SERVICES PTE LTD
5 YISHUN STREET 23, SINGAPORE 768442, SINGAPORE
Covered Property (1)
Process and Support Carrier for Flexible Substrates
Patent: 6,581,278 →
Application: 09/759,904 →
Publication: US 2002/0093080
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment. Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →