Patent Assignment
Reel/Frame 011975/0563
Assignment of Assignor's Interest
Recorded: 2001-07-12
Pages: 8
Assignors
IWAMOTO, YOSHIO
Executed: 2001-06-29
LENK, JAMES C.
Executed: 2001-06-19
SCHMIDT, PHILIP
Executed: 2001-07-02
SPOHR, CRAIG
Executed: 2001-06-19
STANTON, LESLIE G.
Executed: 2001-06-28
Assignee
MEMC ELECTRONIC MATERIALS, INC.
P.O. BOX 8, 501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Method of Calibrating a Semiconductor Wafer Drying Apparatus
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012273/0145 →
Termination of Security Interest
Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Agreement
Nov 21, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012280/0161 →
Security Interest
Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Security Agreement
Dec 28, 2001
From: MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.; MEMC SOUTHWEST INC.
To: CITICORP USA, INC.
Reel/Frame 012365/0345 →
Release of Security Interest
Aug 11, 2005
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016641/0045 →
Release of Security Interest to Reel/Frame: 012280/0161
Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0794 →