Patent Assignment
Reel/Frame 012069/0594
Assignment of Assignor's Interest
Recorded: 2001-08-13
Pages: 3
Assignee
LEICA MICROSYSTEMS LITHOGRAPHY GMBH
D-07745 JENA, GOESCHWITZER STRASSE 25, GERMANY
Covered Property
(1)
Method for Exposing a Layout Comprising Multiple Layers on a Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.