Patent Assignment
Reel/Frame 012344/0800
Assignment of Assignor's Interest
Recorded: 2001-12-06
Pages: 3
Assignors
BOON, TAN HIEN
Executed: 2001-06-28
ZHENG, ZHENG
Executed: 2001-06-28
TRASPORTO, ARNEL
Executed: 2001-06-28
Assignee
ST ASSEMBLY TEST SERVICES PTE, LTD.
5 YISHUN STREET 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Die Paddle Enhancement for Exposed Pad in Semiconductor Packaging
Patent:
6,380,048 →
Application:
09/920,599 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0360 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →