Granted Patent
Utility
US 6,380,048
· Confirmation No. 6370
DIE PADDLE ENHANCEMENT FOR EXPOSED PAD IN SEMICONDUCTOR PACKAGING
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-04-07 | OATH |
Oath or Declaration filed | 8 | View | |
| 2001-08-02 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-08-02 | SPEC |
Specification | 29 | View | |
| 2001-08-02 | CLM |
Claims | 7 | View | |
| 2001-08-02 | ABST |
Abstract | 1 | View | |
| 2001-08-02 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2001-08-02 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Tan Hien Boon
Singapore, SINGAPORE
Zheng Zheng
Singapore, SINGAPORE
Arnel Trasporto
Singapore, SINGAPORE
Attorneys & Agents of Record
Classification
USPC
438/456
H10W70/411
H10W72/884
H10W72/551
H10W72/952
H10W74/127
H10W72/075
H10W70/424
H10W90/756
H10W74/00
H10W90/736
Prosecution
Patent Term Adjustment
0days
No related applications found.
RELEASE OF SECURITY INTEREST
Recorded 2020-06-16
SECURITY INTEREST
Recorded 2015-08-06
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-12-06
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