Patent Assignment
Reel/Frame 012396/0732
Assignment of Assignor's Interest
Recorded: 2001-12-15
Pages: 3
Assignee
ADVANCED MICRO DEVICES, INC.
P.O. BOX 3453, ONE AMD PLACE,, SUNNYVALE, CALIFORNIA, 94088
Covered Property
(1)
Method for Manufacturing Memory with High Conductivity Bitline and Shallow Trench Isolation Integration
Patent:
6,723,605 →
Application:
10/022,292 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 22, 2007
From: ADVANCED MICRO DEVICES, INC.
To: SPANSION INC.
Reel/Frame 019047/0566 →
Assignment of Assignor's Interest
Mar 27, 2007
From: SPANSION INC.
To: SPANSION LLC
Reel/Frame 019069/0336 →
Security Agreement
Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
Release of Security Interest
Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest
Jun 29, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036032/0333 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →