Patent Assignment
Reel/Frame 012682/0085
Assignment of Assignor's Interest
Recorded: 2002-03-07
Pages: 6
Assignors
FOGELSON, HARRY J.
Executed: 2002-02-12
BANCOD, LUDOVICO E.
Executed: 2002-02-12
ANDERSON, WILLIAM M.
Executed: 2002-02-12
SYED, AHMER
Executed: 2002-02-12
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Reduced Copper Lead Frame for Saw-Singulated Chip Package
Patent:
6,885,086 →
Application:
10/093,267 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →