Patent Assignment
Reel/Frame 012781/0148
Assignment of Assignor's Interest
Recorded: 2002-04-05
Pages: 4
Assignors
SHIM, IL KWON
Executed: 2002-03-19
CHOW, SENG GUAN
Executed: 2002-03-19
BALANON, GERRY
Executed: 2002-03-19
Assignee
ST ASSEMBLY TEST SERVICES PTE. LTD
5 YISHUN STREET 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Semiconductor Package Having Heat Sink Attached to Pre-Molded Cavities and Method for Creating the Package
Patent:
6,534,859 →
Application:
10/116,983 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0360 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →