Patent Assignment
Reel/Frame 012843/0660
Assignment of Assignor's Interest
Recorded: 2002-04-23
Pages: 2
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARA, ITAMI-SHI, HYOGO 664-0005, JAPAN
Covered Property
(1)
Semiconductor Device That Can Have a Defective Bit Found During or After Packaging Process Repaired
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name and Address of the Second Assignee Previously Recorded on Reel 012843 Frame 0660.
Aug 6, 2002
From: OHMURA, RYUJI; SUGIURA, KAZUSHI
To: MITSUBISHI DENKI KABUSHIKI KAISHA; RYODEN SEMICONDUCTOR SYSTEMS ENGINEERING CORPORATION
Reel/Frame 013173/0474 →
Assignment of Assignor's Interest
Mar 18, 2011
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025980/0219 →
Merger
Jun 13, 2017
From: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
To: RENESAS NAKA SEMICONDUCTOR CORPORATION
Reel/Frame 042692/0192 →
Change of Name
Sep 13, 2017
From: RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
To: RENESAS SEMICONDUCTOR ENGINEERING CORPORATION
Reel/Frame 043583/0156 →
Merger
Sep 19, 2017
From: RENESAS NAKA SEMICONDUCTOR CORPORATION
To: RENESAS SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 043902/0816 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →