Patent Assignment
Reel/Frame 012885/0360
Assignment of Assignor's Interest
Recorded: 2002-05-10
Pages: 3
Assignor
PENDSE, RAJENDRA
Executed: 2002-04-11
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Property
(1)
Apparatus and Process for Precise Encapsulation of Flip Chip Interconnnects
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →