Patent Assignment
Reel/Frame 013031/0828
Assignment of Assignor's Interest
Recorded: 2002-06-19
Pages: 4
Assignors
HU, TOM
Executed: 2002-06-17
DAVIS, TERRY W.
Executed: 2002-06-17
BANCOD, LUDOVICO E.
Executed: 2002-06-17
SHIN, WON DAI
Executed: 2002-06-17
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Saw and Etch Singulation Method for a Chip Package
Patent:
6,841,414 →
Application:
10/174,603 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →