Saw and etch singulation method for a chip package
View Patent ↗A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.
1. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a lead frame strip defining a multiplicity of lead frames which each include:
an outer frame defining a central opening;
a die pad disposed within the central opening; and
a plurality of leads attached to the outer frame and extending toward the die pad in spaced relation to each other;
the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets;
b) attaching semiconductor dies to respective ones of the die pads;
c) mechanically and electrically connecting the semiconductor dies to the leads of respective ones of the lead frames;
d) applying an encapsulant material to the lead frame strip to form a mold cap which at least partially encapsulates the lead frames, the semiconductor dies, and the conductive wires;
e) sawing the mold cap along the saw streets to expose the connecting bars; and
f) etching the connecting bars to separate the lead frames from each other.
2. The method of claim 1 wherein:
step (a) comprises providing a lead frame strip which includes a layer of thermal tape applied to one side thereof;
step (d) comprises applying the encapsulant material to a side of the lead frame strip opposite that including the layer of thermal tape applied thereto; and
step (f) comprises etching the connecting bars to the layer of thermal tape.
3. The method of claim 2 further comprising the step of:
(g) removing the layer of thermal tape from the lead frames.
4. The method of claim 1 wherein step (b) comprises bonding the semiconductor dies to respective ones of the die pads.
5. The method of claim 1 wherein step (c) comprises mechanically and electrically connecting the semiconductor dies to the leads of respective ones of the lead frames via conductive wires.
6. A method of singulating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets, the method comprising the steps of:
a) sawing the mold cap along the saw streets to expose the connecting bars; and
b) etching the connecting bars to separate the lead frames from each other.
7. The method of claim 6 wherein a layer of thermal tape is applied to a side of the lead frame strip opposite that including the mold cap applied thereto, and step (b) comprises etching the connecting bars to the layer of thermal tape.
8. The method of claim 7 further comprising the step of:
c) removing the lead frames from the layer of thermal tape.
9. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a leadframe strip including a layer of thermal tape applied to one side thereof and a multiplicity of leadframes which each include:
an outer frame defining a central opening;
a die pad disposed within the central opening; and
a plurality of leads attached to the outer frame and extending toward the die pad in spaced relation to each other;
the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets;
b) attaching semiconductor dies to respective ones of the die pads;
c) mechanically and electrically connecting the semiconductor dies to the leads of respective ones of the leadframes;
d) applying encapsulant material to a side of the leadframe strip opposite that including the layer of thermal tape applied thereto to form a plurality of package bodies which at least partially encapsulate respective ones of the leadframes, the semiconductor dies, and the conductive wires, the package bodies being formed such that the connecting bars are exposed therebetween; and
e) etching the connecting bars to the layer of thermal tape to separate the leadframes from each other.
10. The method of claim 9 further comprising the step of:
f) removing the layer of thermal tape from the leadframes.
11. The method of claim 9 wherein step (b) comprises bonding the semiconductor dies to respective ones of the die pads.
12. The method of claim 9 wherein step (c) comprises mechanically and electrically connecting the semiconductor dies to the leads of respective ones of the leadframes via conductive wires.
13. A method of singulating semiconductor packages from a leadframe strip which includes a plurality of package bodies formed on one side thereof, a layer of thermal tape applied to a side opposite that including the package bodies formed thereon, and a multiplicity of leadframes integrally connected to each other by connecting bars which are exposed between the package bodies and extend in multiple rows and columns and define saw streets, the method comprising the step of:
a) etching the connecting bars to the layer of thermal tape to separate the leadframes from each other.
14. The method of claim 13 further comprising the step of:
b) removing the leadframes from the layer of thermal tape.
15. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a lead frame strip defining a multiplicity of lead frames which each include:
an outer frame defining a central opening; and
a plurality of leads attached to the outer frame and extending into the central opening in spaced relation to each other;
the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets;
b) electrically connecting semiconductor dies to the leads of respective ones of the lead frames;
c) applying an encapsulant material to the lead frame strip to form a mold cap which at least partially encapsulates the lead frames, the semiconductor dies, and the conductive wires;
d) sawing the mold cap along the saw streets to expose the connecting bars; and
f) etching the connecting bars to separate the lead frames from each other.
16. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a leadframe strip including a layer of thermal tape applied to one side thereof and a multiplicity of leadframes which each include:
an outer frame defining a central opening; and
a plurality of leads attached to the outer frame and extending into the central opening in spaced relation to each other;
the outer frames being integrally connected to each other and collectively defining connecting bars which extend in multiple rows and columns and define saw streets;
b) electrically connecting semiconductor dies to the leads of respective ones of the leadframes;
c) applying encapsulant material to a side of the leadframe strip opposite that including the layer of thermal tape applied thereto to form a plurality of package bodies which at least partially encapsulate respective ones of the leadframes, the semiconductor dies, and the conductive wires, the package bodies being formed such that the connecting bars are exposed therebetween; and
d) etching the connecting bars to the layer of thermal tape to separate the leadframes from each other.