IP Library Assignment 013176/0933
Patent Assignment
Reel/Frame 013176/0933

Assignment of Assignor's Interest

Recorded: 2002-08-02 Pages: 4
Assignors
KIM, YOUNG HO
Executed: 2002-07-24
CHOI, SEOK HYUN
Executed: 2002-07-29
LEE, CHOON HEUNG
Executed: 2002-07-29
PARK, SUNG SU
Executed: 2002-07-24
PARK, SUNG SOON
Executed: 2002-07-25
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Property (1)
Semiconductor Package and Method of Manufacturing the Same Which Reduces Warpage
Patent: 7,042,072 →
Application: 10/212,496 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Jun 3, 2009
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 022764/0864 →
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →