Patent Assignment
Reel/Frame 013216/0666
Assignment of Assignor's Interest
Recorded: 2002-08-16
Pages: 2
Assignors
ISE, HIROTOSHI
Executed: 2002-07-05
OONO, TOSHIKI
Executed: 2002-07-05
KIMURA, YASUHIRO
Executed: 2002-07-05
KOMEMURA, TOSHIO
Executed: 2002-07-05
TOYOTA, MASATO
Executed: 2002-07-05
NOGUCHI, TOSHIHIKO
Executed: 2002-07-05
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
MITSUBISHI ELECTRIC ENGINEERING COMPANY LTD.
6-2, OOTEMACHI 2-CHOME, CHIYODA-KU, TOKYO 100-0004, JAPAN
Covered Property
(1)
Defect Inspecting Device for Substrate to Be Processed and Method of Manufacturing Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 10, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0001 →
Assignment of Assignor's Interest
Aug 24, 2017
From: MITSUBISHI ELECTRIC ENGINEERING CO., LTD.
To: RENESAS SYSTEM DESIGN CO., LTD.
Reel/Frame 043668/0291 →
Change of Address
Nov 28, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044512/0218 →
Merger
Nov 28, 2017
From: RENESAS SYSTEM DESIGN CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044921/0873 →