Patent Assignment
Reel/Frame 013259/0828
Assignment of Assignor's Interest
Recorded: 2002-08-29
Pages: 2
Assignors
NISHIYAMA, HIDETOSHI
Executed: 2002-07-25
NOGUCHI, MINORI
Executed: 2002-07-29
OHSHIMA, YOSHIMASA
Executed: 2002-07-26
HAMAMATSU, AKIRA
Executed: 2002-07-25
WATANABE, KENJI
Executed: 2002-08-05
WATANABE, TETSUYA
Executed: 2002-07-30
JINGU, TAKAHIRO
Executed: 2002-08-01
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI ELECTRONICS ENGINEERING CO., LTD.
F NISSEI EBISU BLDG., 16-3, HIGASHI 3-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
Method and Its Apparatus for Inspecting Particles or Defects of a Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 18, 2004
From: HITACHI ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
Reel/Frame 015065/0870 →
Assignment of Assignor's Interest
Jul 21, 2005
From: HITACHI HIGH-TECH ELECTRONICS ENGINEERING CO., LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 016547/0118 →
Assignment of Assignor's Interest
Feb 3, 2017
From: HITACHI, LTD.
To: HITACHI HI-TECHNOLOGIES CORPORATION
Reel/Frame 041164/0139 →
Change of Address
Feb 3, 2017
From: HITACHI, LTD.
To: HITACHI, LTD.
Reel/Frame 041610/0882 →
Corrective Assignment to Correct the Address Previously Recorded on Reel 041164 Frame 0139. Assignor(S) Hereby Confirms the Address Should Be High-Technologies and Not Hi-Technologies.
Feb 9, 2017
From: HITACHI, LTD.
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 041666/0181 →
Change of Name and Address
Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →