Patent Assignment
Reel/Frame 013348/0051
Assignment of Assignor's Interest
Recorded: 2002-09-27
Pages: 4
Assignors
SHIM, IL KWON
Executed: 2002-09-04
RAMAKRISHNA, KAMBHAMPATI
Executed: 2002-09-04
SENG, GUAN CHOW
Executed: 2002-09-04
Assignee
ST ASSEMBLY TEST SERVICES PTE LTD
5 YISHUN STREET 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Leadframe for Die Stacking Applications and Related Die Stacking Concepts
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →