IP Library › Assignment 013459/0001
Patent Assignment
Reel/Frame 013459/0001

Assignment of Assignor's Interest

Recorded: 2003-03-06 Pages: 4
Assignors
DANOVITCH, DAVID
Executed: 2003-02-10
KILPATRICK, STEPHEN
Executed: 2003-02-17
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Dual-Solder Flip-Chip Solder Bump
Patent: 6,893,799 →
Application: 10/248,976 →
Publication: US 2004/0175657
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2012
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ULTRATECH, INC.
Reel/Frame 028867/0216 →
Assignment of Assignor's Interest Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →