Patent Assignment
Reel/Frame 013899/0663
Assignment of Assignor's Interest
Recorded: 2003-08-22
Pages: 3
Assignor
LIU, YU-CHENG
Executed: 2003-06-19
Assignee
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
[Sputtering Apparatus and Manufacturing Method of Metal Layer/Metal Compound Layer by Using Thereof]
Patent:
6,811,662 →
Application:
10/604,857 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.