Patent Assignment
Reel/Frame 013905/0105
Assignment of Assignor's Interest
Recorded: 2003-03-31
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-09-19
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES
1753, SHIMONUMABE NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8666, JAPAN
Covered Properties
(4)
Substrate with a Compound Semiconductor Surface Layer and Method for Preparing the Same
Patent:
5,549,749 →
Application:
08/426,951 →
Compound Semiconductor Device Having an Ion Implanted Defect-Rich Layer for Improved Backgate Effect Suppression
Patent:
6,420,775 →
Application:
08/806,985 →
Semiconductor Circuitry Device and Method for Manufacturing the Same
Patent:
6,429,043 →
Application:
09/566,390 →
Semiconductor Photodetector
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 26, 1997
From: ASAI, SHUJI
To: NEC CORPORATION
Reel/Frame 008526/0292 →
Assignment of Assignor's Interest
May 8, 2000
From: NAKAZAWA, TAIBO; HIRASAWA, KOKI
To: NEC CORPORATION
Reel/Frame 010788/0446 →
Assignment of Assignor's Interest
Dec 8, 2000
From: KUSAKABE, ATSUHIKO
To: NEC CORPORATION
Reel/Frame 011353/0132 →
Assignment of Assignor's Interest
Feb 25, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 013798/0626 →
Document Re-Recorded to Correct an Error Contained in Property Number 09/806,985 in the Document Previously Recorded on Reel 013905, Frame 0105. Assignor Hereby Confirms the Assignment of the Entire Interest.
Nov 17, 2003
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 014133/0945 →
Assignment of Assignor's Interest
Apr 4, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017422/0528 →
Change of Name
Oct 21, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025173/0161 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0959 →
Change of Name
Nov 18, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025375/0918 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →