IP Library › Assignment 014120/0494
Patent Assignment
Reel/Frame 014120/0494

Assignment of Assignor's Interest

Recorded: 2003-06-02 Pages: 3
Assignors
RANADE, RAJIV
Executed: 2003-04-12
MATHAD, GANGADHARA S.
Executed: 2003-04-14
Assignee
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
1730 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95112
Covered Property (1)
Method to Fill Deep Trench Structures with Void-Free Polysilicon or Silicon
Patent: 6,809,005 →
Application: 10/386,880 →
Publication: US 2004/0180510
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 2, 2003
From: CHAN, KEVIN K.; KULKARNI, SUBHASH B.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014120/0986 →
Assignment of Assignor's Interest Jan 13, 2004
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 014253/0557 →
Assignment of Assignor's Interest Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023788/0535 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →