IP Library Assignment 014120/0986
Patent Assignment
Reel/Frame 014120/0986

Assignment of Assignor's Interest

Recorded: 2003-06-02 Pages: 3
Assignors
CHAN, KEVIN K.
Executed: 2003-04-16
KULKARNI, SUBHASH B.
Executed: 2003-04-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method to Fill Deep Trench Structures with Void-Free Polysilicon or Silicon
Patent: 6,809,005 →
Application: 10/386,880 →
Publication: US 2004/0180510
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 2, 2003
From: RANADE, RAJIV; MATHAD, GANGADHARA S.
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 014120/0494 →
Assignment of Assignor's Interest Jan 13, 2004
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 014253/0557 →
Assignment of Assignor's Interest Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023788/0535 →
Assignment of Assignor's Interest May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →