IP Library › Assignment 014258/0055
Patent Assignment
Reel/Frame 014258/0055

Assignment of Assignor's Interest

Recorded: 2003-07-14 Pages: 2
Assignor
AIRIFY COMMUNICATIONS
Executed: 2003-06-20
Assignee
AIRIP CORPORATION
2275 E. BAYSHORE RD, SUITE 150, PALO ALTO, CALIFORNIA, 94303
Covered Property (1)
Method for the Production of Low Defect Density Silicon
Patent: 6,858,307 →
Application: 09/972,608 →
Publication: US 2002/0056410
Related Assignments (13)
Other recorded transfers of the patent in this record — the chain of ownership.
Termination of Security Interest Nov 21, 2001
From: E.ON AG
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012263/0944 →
Security Interest Dec 27, 2001
From: MEMC ELECTRONIC MATERIALS, INC.
To: E. ON AG
Reel/Frame 012407/0806 →
Assignment of Assignor's Interest Jan 2, 2002
From: VORONKOV, VLADIMIR; FALSTER, ROBERT J.; BANAN, MOHSEN
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 012409/0073 →
Security Agreement Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →
Security Agreement Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Release of Security Interest to Reel/Frame: 013964/0378 Mar 17, 2014
From: CITICORP USA, INC.
To: MEMC ELECTRONIC MATERIALS, INC. (NOW KNOWN AS SUNEDISON, INC.); MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
Reel/Frame 032458/0958 →
Assignment of Assignor's Interest May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
Notice of License Agreement Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →