IP Library › Assignment 014287/0786
Patent Assignment
Reel/Frame 014287/0786

Assignment of Assignor's Interest

Recorded: 2004-01-28 Pages: 3
Assignor
KARNEZOS, MARCOS
Executed: 2004-01-23
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CALIFORNIA, 94538
Covered Properties (2)
Semiconductor Multi-Package Module Having Inverted Second Package Stacked Over Die-Up Flip-Chip Ball Grid Array (Bga) Package
Patent: 6,906,416 →
Application: 10/681,747 →
Publication: US 2004/0113275
Semiconductor multi-package module having inverted second package
Application: 60/417,277 →
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS; CARSON, FLYNN
To: CHIPPAC, INC.
Reel/Frame 014288/0207 →
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014287/0776 →
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014287/0795 →
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC INC
Reel/Frame 014287/0819 →
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014288/0190 →
Assignment of Assignor's Interest Jan 28, 2004
From: KARNEZOS, MARCOS
To: CHIPPAC, INC.
Reel/Frame 014288/0193 →
Merger and Change of Name Aug 6, 2015
From: CHIPPAC, INC.; STATS CHIPPAC, INC.
To: STATS CHIPPAC, INC.
Reel/Frame 036286/0612 →
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD
To: STATS CHIPPAC PTE. LTE
Reel/Frame 038378/0200 →
Release of Security Interest Jun 4, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052844/0491 →