Patent Assignment
Reel/Frame 014514/0399
Assignment of Assignor's Interest
Recorded: 2003-09-15
Pages: 13
Assignors
LEE, CHU-CHUNG
Executed: 2003-08-12
HARUN, FUAIDA
Executed: 2003-08-06
HESS, KEVIN J.
Executed: 2003-08-12
TAN, LAN CHU
Executed: 2003-08-06
YONG, CHENG CHOI
Executed: 2003-08-06
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, LAW DEPARTMENT, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Integrated Circuit Die Having a Copper Contact and Method Therefor
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 7, 2004
From: MOTOROLA, INC
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 015360/0718 →
Security Agreement
Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
Security Agreement
May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
Assignment of Assignor's Interest
Oct 23, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: ZOZO MANAGEMENT, LLC
Reel/Frame 034038/0946 →
Assignment of Assignor's Interest
Jan 7, 2015
From: ZOZO MANAGEMENT, LLC
To: APPLE INC.
Reel/Frame 034732/0019 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
Patent Release
Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →