Patent Assignment
Reel/Frame 014684/0172
Assignment of Assignor's Interest
Recorded: 2004-06-03
Pages: 5
Assignors
CHOW, SENG GUAN
Executed: 2004-01-29
SHIM, IL KWON
Executed: 2004-01-30
YING, MING
Executed: 2004-01-30
AHN, BYUNG HOON
Executed: 2004-01-30
Assignee
ST ASSEMBLY TEST SERVICES LTD.
5 YISHUN ST 23, SINGAPORE 768442, SINGAPORE
Covered Property
(1)
Semiconductor Package with Passive Device Integration
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 6, 2015
From: ST ASSEMBLY TEST SERVICES LTD.
To: STATS CHIPPAC LTD.
Reel/Frame 036286/0590 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0400 →
Release of Security Interest
Jun 16, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052950/0497 →
Corrective Assignment to Correct the Assignee's Name Previously Recorded at Reel: 038378 Frame: 0400. Assignor(S) Hereby Confirms the Assignment.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064806/0593 →